Epoxy– tag –
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Novel Low-CTE Epoxy Molding Compound Developed to Tackle Warpage in Large AI Semiconductors
Journal of Materials Science & Technology Global Overview Researchers have developed a novel low-coefficient of thermal expansion (CTE) epoxy molding compound specifically for encapsulating large dies such as HBM and AI semiconductors. T... -
Researchers Develop Degradable Epoxy-Acid Thermosetting Polymers and Recyclable CFRP Composites Using Phthalic Anhydride-Derived Dual-Functional Hardeners
ResearchGate International Overview Researchers have designed novel liquid resins for chemically recyclable polymer networks based on dual-functional liquid hardeners derived from phthalic anhydride, enabling efficient polymer separation... -
Evonik Enhances Composite Performance with Crosslinkers for Lightweight, High-Strength, and High-Fatigue Resistance Epoxy Systems in Wind Turbine Blades
Evonik Germany Overview Evonik offers advanced crosslinkers for composites, specifically targeting wind turbine blades, enabling the development of lightweight, strong, and highly fatigue-resistant epoxy systems. These crosslinkers suppo... -
Zhengzhou Kerton Chemical Highlights Broad Applications of Epoxy Adhesives for High Performance and Reliability Across Industries
Zhengzhou Kerton Chemical Co., Ltd China Overview Zhengzhou Kerton Chemical Co., Ltd. emphasized the critical role of epoxy adhesives across diverse sectors including automotive, aerospace, electronics, construction, and new energy. For ... -
Expanding Applications of Fiber-Reinforced Polymers in Maritime: Epoxy and Vinylester Composites Meet High Strength and Durability Demands
ResearchGate / UTHM Publisher International Overview Composite materials, particularly Fiber-Reinforced Polymers (FRP), offer high strength-to-weight ratios, excelling in constructing complex lightweight structures for the maritime indus... -
Novel Mesogen-Containing Epoxy Monomer Enhances Thermally Conductive Potting Compounds, Balancing Thermal Conductivity and Reliability
MDPI Switzerland Overview A mesogen-containing reactive epoxy monomer (LCE) was designed, synthesized, and incorporated into commercial thermally conductive epoxy potting compounds to tune their thermal, rheological, and mechanical prope... -
Flexible Epoxy and Sintered Silver Micro-fillers Advance Low-Temperature Sintering and Reliability in WBG Semiconductor Packaging
ResearchGate Global Overview A new study reports that die-attach materials combining flexible epoxy binders with sintered silver (s-Ag) micro-fillers accelerate low-temperature sintering and significantly enhance interconnection properti... -
Wind Turbine Blade Epoxy Upcycled into High-Strength Adhesives via Novel Mild Catalytic Oxidation Method
Engineering (ScienceDirect) China Overview A new study in Engineering demonstrates a mild catalytic oxidation method that converts epoxy resin from end-of-life wind turbine blades into high-performance adhesives. This sustainable approac... -
AI Theme Propels Nikkei 225, Driving Significant Gains for Advanced Packaging Material Companies like Resonac and Mitsui Kinzoku
IG Japan Overview The latest Nikkei 225 analysis highlights the significant impact of the AI theme on the market, showing substantial gains for chemical manufacturers like Resonac, a global leader in advanced packaging materials and epox... -
Samsung Electronics Leads Advanced Packaging with Projected Triple HBM Sales and Thinnest 0.65mm LPDDR DRAM Package Development
Simply Wall St South Korea Overview Samsung Electronics is leading advanced packaging advancements by leveraging extensive in-house expertise to streamline production cycles and reduce lead times. The company projects its High Bandwidth ...
