Epoxy– tag –
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COMSOL and Infrared Thermography Enable Quantitative Defect Characterization in Multi-Material Power Equipment, Elucidating CFRP Thermal Behavior
Preprints.org Switzerland Overview A new study successfully investigated the thermal response mechanisms and quantitative characterization of defects in multi-material power equipment using COMSOL Multiphysics finite element simulations ... -
Fengling New Materials: Expert Manufacturer of UV-Curable Adhesives for Electronics, Medical, and Optical Industries
YouTube (Fengling New Materials) China Overview Fengling New Materials specializes in UV-curable adhesives, epoxy adhesives, and advanced bonding materials for diverse industrial applications including electronics, medical devices, optic... -
DalFort Capital Partners Closes Second Fund at $166 Million, Exceeding Hard Cap; Successfully Sells Polymer Adhesives Holdings
PR Newswire USA Overview DalFort Capital Partners announced the successful closing of its second fund at $166 million, exceeding its hard cap. Simultaneously, the firm announced the sale of Polymer Adhesives Holdings, a manufacturer of h... -
PatSnap Eureka Report: Reducing Voiding in Chip Embedding Epoxies Critical for High-Reliability Systems in Automotive and Aerospace
PatSnap Eureka Global Overview A PatSnap Eureka report identifies reducing voiding in chip embedding epoxies as a critical reliability challenge in high-performance electronic packaging, particularly for automotive and aerospace systems.... -
Sumitomo Bakelite Develops G785 Series High-Tg Epoxy Molding Compounds with Industry-Leading 230°C Tg for Next-Gen SiC Power Modules
Sumitomo Bakelite Co., Ltd. Japan Overview Sumitomo Bakelite has developed the 'G785 Series' of high-Tg epoxy molding compounds for next-generation SiC power modules, achieving an industry-leading glass transition temperature (Tg) of 230... -
Alliance Chemical Report: Advanced Talc Applications Crucial for EV Battery Thermal Management and Power Electronics Reliability
Alliance Chemical USA Overview An Alliance Chemical report highlights that engineered talc grades are becoming critical in high-tech manufacturing, including EV battery thermal management and power electronics. In epoxy molding compounds... -
SemiMedia Reports China Accelerating Global Catch-Up in Advanced Packaging Materials for AI and HPC
SemiMedia China Overview A SemiMedia report indicates that China is accelerating its global catch-up in advanced packaging materials, driven by the demand for AI chips and high-performance computing (HPC). The focus is on developing high... -
Mitsubishi Electric Unveils High-Performance Mold Compounds to Boost Power Semiconductor Electrical Insulation
PatSnap Eureka Japan Overview Mitsubishi Electric has developed an advanced epoxy-based mold compound designed to significantly improve the electrical insulation properties of power semiconductor devices. This innovation integrates high-... -
Low-Stress Mold Compounds Evolve to Protect Fragile Components in Advanced Semiconductor Packages
Global Semiconductor Global Overview Modern low-stress molding technologies encompass diverse material compositions, including silicone-based compounds and modified epoxies with flexible segments. These compounds have evolved to address ... -
Talc’s Multifunctional Role: Enhancing Performance in EV Batteries and Power Electronics
Alliance Chemical USA Overview Talc plays a crucial role in advanced technologies from EV batteries to power electronics. Talc-filled silicone or polyurethane gap pads serve as thermal interface materials in EV battery modules, providing...
