Epoxy– tag –
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Novel Silicone-Free Hybrid TIM Achieves Stable Low Thermal Resistance Under Harsh Conditions for Power Modules
PatSnap Eureka USA Overview Research from PatSnap Eureka reports on a novel thermal interface material (TIM) optimized for power modules operating under harsh temperature and humidity. The proposed material, a silicone-free epoxy-polysil... -
Henkel Expert Reveals Material Innovations Critical for Power Electronics Reliability and Thermal Management
EE Times USA Overview Dr. Bruchak Conley from Henkel discussed the pivotal role of material evolution in power electronics, emphasizing that die attach encapsulants and thermal interface materials (TIMs) dictate module reliability under ... -
Sumitomo Bakelite Announces Price Increase for Semiconductor Encapsulation Epoxy Molding Compounds
住友ベークライト株式会社 Japan Overview Sumitomo Bakelite has announced a price revision for its SUMIKON™ EME series of epoxy resin molding compounds for semiconductor encapsulation, effective June 1, 2026, with increases ranging from 10...
