HBM– tag –
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AI Demand Strains CoWoS and SoIC Supply: Global Demand to Double to Over 2.5M Wafers by 2027, Facing 10-20% Shortfall
Exponential Industry USA Overview TSMC's CoWoS and SoIC advanced packaging technologies are now the primary physical constraints for AI GPU and accelerator production. Global CoWoS demand is projected to double from 1.3-1.4 million wafer... -
TSMC Achieves Over 98% CoWoS Yield; ABF Substrates Emerge as Next Bottleneck for AI Chip Expansion
Xenospectrum Taiwan Overview TSMC has announced that its advanced CoWoS packaging technology, particularly for 5.5x reticle AI chip products, consistently achieves yields exceeding 98%. While CoWoS capacity has doubled annually for three... -
TSMC CoWoS Advanced Packaging Becomes Critical Bottleneck in AI Chip Supply, Sold Out Through 2026
Tech Times USA Overview The bottleneck in AI chip production has shifted from silicon manufacturing to advanced packaging, specifically TSMC's CoWoS technology, with capacity fully booked until the end of 2026. A severe shortage of ABF s... -
Supercomputing News Emphasizes Critical Role of Advanced Packaging (CoWoS, EMIB, T-AI) in AI Accelerators
Supercomputing News Global Overview Supercomputing News published an analytical article emphasizing the critical role of advanced packaging technologies like CoWoS, EMIB, and T-AI in enhancing AI accelerator performance. These technologi... -
TrendForce Analyzes: 18 Chinese Enterprises Accelerate Positions in Glass Core Substrate Market
TrendForce Taiwan Overview TrendForce reported that 18 Chinese companies are rapidly enhancing their presence in the glass core substrate market for advanced packaging. This movement is part of China's strategy to achieve supply chain au... -
South Korea Unveils Major Investment Plan to Boost National Competitiveness in Advanced Packaging
Maeil Business Newspaper (MK.co.kr) South Korea Overview The South Korean government announced a large-scale investment plan to enhance national competitiveness in advanced packaging. This strategy aims to meet surging demand for AI and ... -
ASE Technology Raises 2026 CapEx to Record US$10.5 Billion, Targets 2x Advanced Packaging Revenue by 2027
TrendForce Taiwan Overview TrendForce reports that ASE Technology Holding, the world's largest OSAT company, plans to raise its 2026 capital expenditure (CapEx) to a record US$10.5 billion. The company aims to double its revenue from adv... -
TrendForce Reports TSMC Expanding CoWoS Front-End Outsourcing to OSATs Amid Surging NVIDIA ASIC Demand
TrendForce Taiwan Overview TrendForce reports that TSMC is reportedly expanding the outsourcing of key front-end processes for its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging to OSATs (Outsourced Semiconductor Assembly and Test... -
Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2026 in Suwon, Korea, to Cover Advanced Packaging, Chiplets, and HBM
Advanced Semiconductor Packaging & Chiplet Show (ASPS) South Korea Overview The Advanced Semiconductor Packaging & Chiplet Show (ASPS) will take place from August 26-28, 2026, at the Suwon Convention Center in South Korea. This B2B e... -
Glass Substrates Emerge as AI Packaging Game-Changer, Igniting Global Race Towards Mass Production as China and Japan Intensify Competition for Yield Stabilization
The Economy South Korea Overview As AI semiconductor competition shifts from process-node miniaturization to advanced packaging, China and Japan are intensifying efforts to lead the glass core substrate market, a cornerstone for next-gen...
