HBM– tag –
-
AI Industry Unpacked: July 25, 2026 – NVIDIA’s Blackwell Ultra, Microsoft’s Agentic AI, and EU Regulatory Milestones
AI Industry Daily International Overview On July 25, 2026, the AI industry witnessed pivotal developments, including NVIDIA's detailed release on its next-generation 'Blackwell Ultra' AI chip, Microsoft's advancements in Agentic AI, and ... -
NVIDIA and SK Group Forge $500 Billion AI Alliance for 2GW Data Centers and HBM Supply
MLQ.ai International Overview NVIDIA and South Korea's SK Group have forged a $500 billion strategic AI partnership focused on co-developing a 2-gigawatt (GW) next-generation AI data center and ensuring a long-term supply of high-bandwid... -
AI Chip Showdown: NVIDIA, AMD, and Intel Ignite New Battleground in 2026 with Blackwell Ultra and Instinct MI400
CryptoBriefing International Overview The AI chip race is set to intensify dramatically in 2026, as NVIDIA's 'Blackwell Ultra' and AMD's Instinct MI400 series usher in a fierce new phase of competition against Intel. These tech giants ar... -
Chiplet Underfill Dispensing Market to Grow Through 2036 Driven by HBM and C2W Hybrid Bonding Void Reduction Needs
Fact.MR USA Overview This article summarizes a market research report from Fact.MR. The chiplet underfill dispensing market is growing, driven by the need for wafer-level underfill in HBM manufacturing and tailored viscosity/cure profile... -
SK Hynix to Launch Advanced Packaging Plant in Indiana, USA by H2 2028 to Meet Surging HBM3 Demand
BigGo Finance South Korea Overview SK hynix is driving aggressive capacity expansion to meet the surging demand for High Bandwidth Memory 3 (HBM3). The company plans to begin operations at an advanced packaging plant in Indiana, USA, by ... -
NCF Evolves into Essential Material for AI Chips, HBM Stacking, and Advanced Packaging, Ensuring Stable Bonding and Enhanced Reliability
LP Information Data Global Overview Non-Conductive Film (NCF) has evolved from an auxiliary adhesive to an indispensable material in advanced packaging, driven by rapid advancements in AI servers, accelerated computing chips, High-Bandwi... -
SK hynix Unveils $4 Billion Indiana HBM Plant, Bolstering U.S. Semiconductor Packaging and AI Supply Chains
Silicon Analysts USA Overview SK hynix has announced a significant $4 billion investment to establish an advanced High-Bandwidth Memory (HBM) packaging facility in Indiana, USA, with mass production slated for late 2028. This strategic m... -
BESI Records All-Time High Orders with 128.8% Y-o-Y Growth Driven by AI Packaging and Hybrid Bonding Demand
BE Semiconductor Industries N.V. Netherlands Overview BE Semiconductor Industries (BESI), a Dutch equipment manufacturer, reported a record €292.9 million in orders for Q2 2026, marking a 128.8% year-on-year increase, fueled by strong de... -
Advanced Package Substrate Market Heats Up: Ibiden Leads with $3.2 Billion Investment, Samsung Electro-Mechanics Challenges with Glass Substrates, Technical Hurdles Emerge
MK Japan Overview The package substrate market, crucial for AI semiconductor performance, is intensifying with major investments and technological competition. Japan's Ibiden maintains dominant leadership with ~35% market share, investin... -
AMD’s Helios AI Rack Challenges NVIDIA with HBM4 Memory Edge, Securing Microsoft as Customer; 2nm Process CPU Also Noted
TrendForce Taiwan Overview AMD's 'Helios AI Rack' is challenging NVIDIA's dominance in the AI market with its HBM4 memory advantage, securing Microsoft as a new key customer. The Helios rack is optimized for AI model training and inferen...
