HBM– tag –
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HBM4 Competition Shifts to Cooling Technology Amid Hybrid Bonding Delays and Nvidia’s Next-Gen GPU Trends
DigiTimes Taiwan Overview Industry experts note that the focus of competition in the 6th-generation High-Bandwidth Memory (HBM4) market is shifting towards cooling technology, against the backdrop of delays in hybrid bonding adoption. HB... -
Co-Packaged Optics (CPO) Demand Reshapes AI Chip Supply Chains, Shifting Towards Higher Bandwidth and Lower Power Consumption
Astute Group UK Overview The surging demand for Co-Packaged Optics (CPO) is fundamentally reshaping semiconductor manufacturing priorities across advanced packaging and AI processor supply chains. As AI clusters increasingly require high... -
SK Hynix Reapproves 7.1 Trillion Won Investment for Cheongju P&T7, Significantly Bolstering Advanced Packaging Capacity for HBM and AI Memory
The Elec South Korea Overview SK Hynix has reapproved a 7.1 trillion won (approximately $5.5 billion) investment for its Cheongju P&T7 project, aiming to significantly bolster its advanced packaging capacity for AI memory products, i... -
South Korean Semiconductor Giants Samsung and SK Hynix Plan $518 Billion Mega-Investment to Double DRAM Production, Reshaping AI Chip Market
CoinDesk South Korea Overview South Korean semiconductor giants Samsung Electronics and SK Hynix have announced massive investment plans totaling approximately $518 billion (about 80 trillion JPY) over the next five years. This capital w... -
HBM Shortage Accelerates ‘Chipflation,’ TrendForce Forecasts New Normal Driven by Unabating AI Demand
The Korea Economic Daily South Korea Overview Surging AI infrastructure demand is driving up memory chip prices, straining cloud providers' profit margins. Market research firm TrendForce predicts that the HBM (High-Bandwidth Memory) sho... -
South Korea’s JNTC and Japan’s TOPPAN Announce Partnership for AI Chip Glass Substrate Technology, Overcoming Organic Substrate Limits for Next-Gen Packaging
Tai (via Semiconductor News) South Korea Overview South Korea's JNTC and Japan's TOPPAN have forged a strategic partnership for next-generation glass substrate technology aimed at AI chips. As advanced packages integrating AI accelerator... -
Samsung Delays Hybrid Bonding HBM Mass Production to 2029-2030, Aligning with Technical Challenges and NVIDIA’s Next-Gen GPUs
TrendForce South Korea Overview Samsung Electronics is reportedly delaying the full-scale mass production of its hybrid bonding technology for next-generation HBM and logic semiconductors until 2029-2030. The company is currently buildin... -
Besi Semiconductor Reports Doubled Quarterly Orders Driven by Soaring AI and Hybrid Bonding Demand, Expanding Customer Base
WHTC (Reuters) Netherlands Overview BE Semiconductor Industries (Besi) announced a more than twofold increase in quarterly orders year-over-year, driven by robust demand from AI, hybrid bonding, photonics, and data centers. The company's... -
AI Chip Packaging Bottleneck Intensifies: NVIDIA Explores Intel EMIB Amid TSMC CoWoS Shortage, Amkor Commits $7B to Arizona
The Economy Japan Overview The burgeoning AI chip market faces a critical bottleneck in advanced packaging, particularly with TSMC's CoWoS technology, prompting NVIDIA to reportedly consider Intel's EMIB for future GPU production. This s... -
AMD Unveils Instinct MI455X AI Accelerator with 432GB HBM4 Memory, Surpassing Nvidia’s Rubin GPU, to Challenge Dominance in Data Centers with CDNA 5 and Helios Rack-Scale Architecture
Tom's Hardware USA Overview AMD has announced the Instinct MI455X AI accelerator, integrating its CDNA 5 and Helios rack-scale architectures. This new product features a substantial 432GB of HBM4 memory, significantly exceeding the 288GB...
