HBM– tag –
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Samsung Announces HBM4E Hybrid Copper Bonding Reduces Package Height by Over 15% While Improving Thermal Characteristics
Sammy Fans South Korea Overview Samsung has presented research on its HBM4E packaging strategy, emphasizing that Hybrid Copper Bonding (HCB), which eliminates underfill materials, offers superior thermal properties compared to convention... -
Future of HBM Hinges on Cooling Innovations: TSVs, High-Conductivity Underfills, and Hybrid Bonding for HBM5+ Are Key
AI Strategies by Kim Joung-Ho South Korea Overview The future of High Bandwidth Memory (HBM) and High Bandwidth Flash (HBF) critically depends on cooling innovations to manage extreme thermal densities. Key advancements include Through-S... -
arXiv Paper Presents Mitigation Techniques for Thermal-Induced Performance Degradation in HBM4/HBM5 3.5D Heterogeneous Packages
arXiv USA Overview A new arXiv paper focuses on addressing thermal-induced memory leakage and soft errors in HBM4/HBM5 vertical stitching interfaces within 3.5D heterogeneous packages. The research proposes improved HBM stacking methods ... -
ECTC 2026 Reveals Breakthroughs in Advanced Packaging: CoWoS-R Warpage Management, IBM’s DBrM, and Nanocrystalline Diamond Cu/Sn Microbumps Highlight Thermal and Integration Advances
SemiAnalysis USA Overview ECTC 2026 showcased advancements in underfill and sealant materials for CoWoS-R warpage management. IBM's 'Direct Bridge Multi-die (DBrM)' using die-edge adhesive technology was introduced, alongside collaborati... -
Novel Low-CTE Epoxy Molding Compound Developed to Tackle Warpage in Large AI Semiconductors
Journal of Materials Science & Technology Global Overview Researchers have developed a novel low-coefficient of thermal expansion (CTE) epoxy molding compound specifically for encapsulating large dies such as HBM and AI semiconductors. T... -
Henkel Unveils High-Performance Underfill Material for Advanced Logic and Memory Packaging, Boosting Production Efficiency
Advanced Packaging Journal Germany Overview Henkel has introduced a new high-performance underfill material designed for advanced logic and memory packaging technologies like flip-chip and chiplets. This material significantly improves d... -
CXMT Confronts HBM Production Barriers: China’s Memory Ambitions Hinge on Yield and Advanced Packaging Breakthroughs by 2028
South China Morning Post China Overview Chinese DRAM manufacturer CXMT continues to grapple with significant technical challenges in establishing stable commercial production of High Bandwidth Memory (HBM), according to SemiAnalysis. Whi... -
Samsung Pivots to HBM4, Hits $1B Sales Milestone, Eyes Optical HBM by 2028
Samsung South Korea Overview Samsung Electronics has aggressively pivoted half of its High Bandwidth Memory (HBM) production capacity to HBM4, achieving over $1 billion in sales within four months and projecting $10 billion annually by y... -
Applied Materials Unleashes Six New Systems to Turbocharge AI Chips with Advanced Packaging and Sub-10nm Defect Detection
Applied Materials USA Overview Applied Materials has launched six innovative systems to significantly accelerate the development and manufacturing of DRAM and advanced packaging for next-generation AI chips. These solutions tackle critic... -
TSMC’s CoWoS Packaging Equipment Supply Chain Sees Robust Demand Amid AI Surge
DigiTimes Taiwan Overview TSMC's CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging equipment supply chain is experiencing extremely strong demand, driven by the explosive growth of AI chips. Key equipment manufacturers are ramping up...
