HBM– tag –
-
Intel Appoints Former SK hynix CEO Lee Seok-hee as Senior VP of Advanced Packaging to Bolster AI Systems
The Korea Herald South Korea Overview Intel has appointed Lee Seok-hee, former CEO of SK hynix and SK On, as Senior Vice President of Intel Foundry. Lee will lead advanced packaging, system integration, back-end technology development, a... -
Micron’s HBM Capacity Sold Out Through 2026, Securing Position in NVIDIA’s Next-Gen AI Platform “Vera Rubin”
Investing.com USA Overview Micron Technology has announced that its high-bandwidth memory (HBM) production capacity is completely sold out through 2026, with long-term contracts secured, reflecting overwhelming demand for AI-driven HBM. ... -
SK Hynix Holds U.S. Talks on HBM Supply and Investment Plans, Bolstering Domestic Semiconductor Supply Chain
digitimes Taiwan Overview SK Hynix reportedly held private discussions with U.S. Deputy Assistant Secretary Alison Hooker regarding high-bandwidth memory (HBM) supply to key U.S. tech firms and potential semiconductor investment plans in... -
SK Hynix Begins Shipping 12-Layer Next-Gen ‘HBM4E’ Samples for AI, Delivering Significant Performance and Power Efficiency Gains Amidst NVIDIA CEO’s Endorsement
SK hynix Inc. South Korea Overview SK Hynix has commenced shipping samples of its 12-layer 'HBM4E,' a next-generation DRAM for AI, to key customers. This HBM4E features data processing speeds of up to 16Gbps per pin and over 20% improved... -
Lam Research Forecasts Over 50% Growth in Advanced Packaging Revenue by 2026, Emerging as a Key AI “Picks and Shovels” Provider
XTB.com USA Overview Lam Research, a leading semiconductor equipment manufacturer, predicts over 50% growth in its advanced packaging related revenue by 2026, driven by soaring demand for AI accelerators, HBM, and chiplet-based architect... -
Samsung’s Advanced Packaging Lag Clouds AI Chip Comeback, Falling Behind TSMC and Intel
digitimes Taiwan Overview Despite efforts in HBM and foundry services, Samsung Electronics' lagging advanced packaging capabilities remain a significant weakness in the AI chip supply chain. Industry sources and Korean media reports indi... -
AI Infrastructure Demand Intensifies Memory Shortage: TSMC CoWoS Constraints and Vietnam Labor Shortages Create Compound Challenges
Sourceability USA Overview Rising AI infrastructure demand is generating new challenges across the semiconductor supply chain, notably a worsening memory shortage. TSMC's CoWoS packaging limitations are expected to persist with the AI bo... -
TSMC and Amkor Sign 10-Year Advanced Packaging Deal in Arizona, Amkor to Invest $7B for CoWoS Supply Boost and US Ecosystem Build-out
Bignewsnetwork India Overview TSMC and Amkor have signed a 10-year strategic agreement to expand semiconductor packaging capabilities in Arizona, USA. This partnership focuses on cutting-edge packaging technologies, including TSMC's InFO... -
Park Systems and imec Forge Alliance for Next-Gen 3D Packaging and Logic Metrology
imec Official Press Release ベルギー Overview Nano-metrology leader Park Systems has launched a two-year Joint Development Program (JDP) with imec, a global semiconductor research powerhouse. The partnership focuses on creating cutting-e... -
ASE Technology Raises 2026 LEAP Revenue Outlook Above $3.5 Billion, Driven by Soaring AI Advanced Packaging Demand
Zacks USA Overview ASE Technology Holding expressed strong confidence in its Leading Edge Advanced Packaging (LEAP) business trajectory, raising its 2026 LEAP revenue outlook by 10% to over $3.5 billion. This upward revision explicitly r...
