HBM– tag –
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Glass Core Substrates Emerge as Next-Gen AI/HPC Packaging Technology, Face Commercialization Hurdles in Brittleness and TGV Formation
Pandaily China Overview Glass core substrates are garnering significant attention in the semiconductor packaging industry, driven by escalating performance demands in AI chips, HPC, and advanced processor packaging. They offer superior d... -
Henkel Expands Electronics Materials Investment in Korea, Bolstering HBM Packaging Material Development for Surging AI Semiconductor Demand
The Elec Inc. South Korea Overview German materials giant Henkel is expanding its investment in the electronics materials business in South Korea to meet the escalating demand for AI semiconductors. This includes reinforcing R&D pers... -
TSMC Strengthens Glass Substrate Supply Chain for CoWoS, Achieving 16% Warpage Reduction for High-Performance AI GPUs
Wccftech USA Overview TSMC is expanding its glass substrate supply chain for advanced CoWoS packaging, collaborating with Innolux and Ibiden. Glass substrates demonstrate a 16% reduction in package warpage, along with improved thermal ex... -
ABF Substrates Become AI Accelerator Bottleneck, Nvidia’s H100 Requires 12+ Layers; Glass Substrates Emerge as Next-Gen Solution, Commercialization Years Away
Data Gravity USA Overview Ajinomoto Build-up Film (ABF) substrates are a critical component and growing bottleneck in AI accelerators, HBM, and chiplet-based designs. Nvidia's H100 GPU demands over 12 layers of ABF, with the Blackwell B2... -
TSMC’s CoWoS Capacity, Targeting 125K-130K Wafers/Month by 2026, Still Falls Short as Nvidia Reserves 60% of Output
INDmoney India Overview TSMC's CoWoS advanced packaging remains a hidden bottleneck in AI chip supply, despite targeting 125,000-130,000 wafers per month capacity by the end of 2026. Demand continues to outstrip supply, with TSMC's CEO s... -
TSMC Narrows CoWoS Supply-Demand Gap from 20% to 10% by End of 2026; NVIDIA to Adopt Next-Gen CoPoS for 2028-2029 Mass Production
Moomoo Singapore Overview TSMC is accelerating advanced packaging capacity expansion, projecting its CoWoS supply-demand gap to significantly narrow from approximately 20% to 10% by the end of 2026. Concurrently, research and development... -
AT&S Unveils €2 Billion Kulim Expansion to Fuel AI Boom with Advanced IC Substrates and PCBs
AT&S Official Press Release オーストリア Overview AT&S is undertaking a monumental €1.5 billion to €2 billion expansion of its Kulim, Malaysia, manufacturing facility. Driven by long-term commitments from industry leaders like AMD, t... -
Advanced Packaging: Glass Core Substrates Emerge as Next-Gen Frontier; Intel Commits Over $1 Billion to R&D for High-Volume Production by 2030
Infra Startups USA Overview Advanced packaging is a critical bottleneck in the AI boom, with TSMC's CoWoS capacity dictating the pace of global AI infrastructure build-out. Shipments of CoWoS wafers are projected to reach approximately 4... -
Samsung, SK Hynix Eye Honam Region in South Korea for First Advanced Packaging Fabs Amid Soaring AI Memory Demand; Amkor Plans $980M Expansion
The Elec Inc. South Korea Overview Samsung Electronics and SK Hynix are considering establishing their first advanced semiconductor packaging plants in South Korea's Honam region to meet surging AI infrastructure demand. Samsung is weigh... -
AI Theme Propels Nikkei 225, Driving Significant Gains for Advanced Packaging Material Companies like Resonac and Mitsui Kinzoku
IG Japan Overview The latest Nikkei 225 analysis highlights the significant impact of the AI theme on the market, showing substantial gains for chemical manufacturers like Resonac, a global leader in advanced packaging materials and epox...
