HBM– tag –
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Malaysia Invests RM185 Million ($40M) in Advanced Semiconductor R&D Initiative, Targeting 7% Global Packaging Market Share with HBM4 Test Chip Development
Malay Mail / Digital News Asia Malaysia Overview Malaysia's Ministry of Science, Technology and Innovation (Mosti) has launched a RM185 million (approx. $40 million USD) Research, Development, Innovation, Commercialization, and Economy (... -
Morgan Stanley: TSMC AI Revenue to Triple by 2027, CoWoS Packaging Remains Critical Bottleneck
HTX Insights (Morgan Stanleyレポート引用) International Overview A new report from Morgan Stanley forecasts TSMC's AI-related revenue to surge by 218% to $86.3 billion by 2027, up from $27.1 billion in 2026. However, this explosive growt... -
ASE Technology Holding Raises 2026 Capex to $8.5 Billion Driven by Surging AI Advanced Packaging Demand, Launches 15 Expansion Projects in Taiwan & Malaysia
SemiMedia Taiwan Overview ASE Technology Holding, the world's largest OSAT provider, has significantly increased its 2026 capital expenditure plan from $7 billion to $8.5 billion, a 21.4% jump, driven by robust demand from AI servers, HP... -
TSMC Boosts CoWoS Capacity, Reducing AI Chip Supply Gap to 10% by Late 2026; Next-Gen CoPoS Pilot Production for NVIDIA’s ‘Feynman’ Slated for 2027
Futuretech Components / Daily Beirut Taiwan Overview TSMC is rapidly expanding its CoWoS advanced packaging capacity to meet surging demand from AI accelerators and HPC applications, projected to narrow the supply-demand gap from 20% to ... -
Applied Materials Unveils New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Applied Materials, Inc. USA Overview Applied Materials has introduced a suite of new material engineering systems designed to accelerate the manufacturing of advanced 3D chip architectures crucial for next-generation AI. These innovation... -
Enverus Reports 800 VDC Architecture Redefines AI Data Center Power Economics: 13% CAPEX Reduction, 14-Point Efficiency Gain
Enverus USA Overview Enverus Intelligence Research reports that next-gen AI chips and rack designs are pushing power densities beyond traditional low-voltage data center systems, making 800 VDC an essential architecture for future AI rac... -
Ajinomoto’s Critical Chip Film, ABF, Faces Supply Test as Escalating AI Demand Mounts Pressure for Price Hikes
digitimes Taiwan Overview Global AI chip demand is putting new pressure on the supply of Ajinomoto Build-up Film (ABF), a key material for advanced semiconductor packaging. Ajinomoto faces increasing pressure to raise ABF prices, making ... -
Resonac CEO Navigates Soaring AI Chip Demand and China Supply Chain Risks, Bolstered by Key Patent Ruling
Crypto Briefing Japan Overview The CEO of Resonac Holdings, a key supplier of non-conductive film for HBM chips and liquid encapsulants for 2.5D semiconductor packages, emphasized strategies for managing surging AI chip demand while miti... -
SK hynix Begins Shipping Next-Gen HBM4E AI Memory Chips with 12-Layer Stack, 48GB Capacity, 16Gbps per Pin, and Over 20% Power Efficiency Boost
Bisinfotech South Korea Overview SK hynix has commenced shipments of its next-generation HBM4E AI memory chips, featuring a 12-layer stack with 48GB capacity, ultra-fast data transfer rates of up to 16Gbps per pin, and over 20% improved ... -
Samsung Considers New HBM-Focused Advanced Semiconductor Packaging Plant in South Korea’s Honam Region to Meet AI Server Demand
SamMobile South Korea Overview Samsung Electronics is exploring the construction of a new advanced semiconductor packaging facility in South Korea's Honam region, with Gwangju emerging as a prime candidate. This project aims to bolster S...
