HBM– tag –
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BE Semiconductor Industries (BESI) Raises Long-Term Revenue Target to €2.2 Billion and Operating Margin Target to 45% Amid Surging Hybrid Bonding Demand
Bits&Chips Netherlands Overview BE Semiconductor Industries (BESI) has significantly raised its long-term annual revenue target from €1.5-1.9 billion to €1.7-2.2 billion, while also increasing the lower end of its operating margin target... -
OSAT Vendors Report Strong Q1 2026 Revenue Growth Driven by AI-Related Advanced Packaging Demand: ASE Up 18%, Amkor Up 25%
Counterpoint Research Global Overview The Outsourced Semiconductor Assembly and Test (OSAT) sector recorded robust revenue growth in Q1 2026, fueled by surging AI-driven advanced packaging demand. ASE Technology Holding reported an 18% y... -
SK hynix Ships 12-Layer HBM4E Samples with Advanced MR-MUF Packaging, Achieving Over 20% Power Efficiency and 17% Thermal Resistance Improvement Over HBM4
Advanced Packaging News South Korea Overview SK hynix announced the sampling of its 12-layer HBM4E memory for next-generation AI systems, leveraging proprietary Advanced MR-MUF packaging. This innovation delivers 48GB capacity per stack ... -
Singapore’s Exports Soar to 22-Year High in May 2026, Driven by AI Semiconductor Supply Chain Contributions from Micron’s HBM Packaging and UMC’s 22nm Production
FSMOne Singapore Overview Singapore's non-oil domestic exports (NODX) recorded their highest growth in 22 years in May 2026, primarily due to the nation's deep integration into the AI semiconductor supply chain. Micron Technology's HBM a... -
ASE Technology Holding Accelerates AI Chip Production with Major Packaging Expansion, Raises 2026 LEAP Revenue Target to Over $3.5 Billion
Crypto Briefing Taiwan Overview ASE Technology Holding is embarking on a significant global expansion, including 15 new facilities, to address the escalating demand for AI chips. This strategic move, leveraging their LEAP platform and VI... -
Hanmi Semiconductor Secures ₩44.2 Billion SK hynix Order for HBM4 TC Bonders, Signaling Robust Advanced Packaging Equipment Market Growth
HTX South Korea Overview Hanmi Semiconductor has received a significant ₩44.2 billion (approx. $32 million) order from SK hynix for its TC Bonder 4.5 Griffin, crucial for next-generation HBM4 production, with delivery slated for early Se... -
Morgan Stanley Raises CoWoS Demand Forecast to 2.69 Million Wafers by 2027, Citing CPUs and ASICs as New Drivers
Industry Analysis / Moomoo Unknown Overview Morgan Stanley has significantly raised its demand forecast for TSMC's CoWoS packaging, projecting it to reach 2.69 million wafers annually by 2027. CPUs and ASICs are emerging as new key drive... -
Samsung and SK Hynix Announce Major HBM Capacity Expansions: Samsung Allocates Half to HBM4, Targeting 250K Wafers/Month by EOY 2026
Industry News / ChosunBiz South Korea Overview Samsung Electronics announced plans to increase its HBM production capacity by approximately 50% from 2025 levels, aiming for 250,000 semiconductor wafers per month by the end of 2026. The c... -
TSMC’s CoWoS Packaging Capacity Identified as Bottleneck in Korea’s HBM4E Race, Despite SK hynix and Samsung Shipments
Aju Press South Korea Overview Despite SK hynix and Samsung Electronics commencing sample shipments of 12-layer HBM4E chips to major customers like Nvidia, TSMC's CoWoS advanced packaging capacity is highlighted as the true bottleneck in... -
Samsung Validates Hybrid Copper Bonding’s Superior Thermal Management for HBM4E, Outperforming TCB
ET News (via IEEE paper) South Korea Overview Samsung published research in IEEE demonstrating that its Hybrid Copper Bonding (HCB) offers significant thermal management advantages over conventional Thermo-Compression Bonding (TCB) for H...
