Intel– tag –
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Photonics
Intel Foundry Unveils Advanced Packaging Innovations for AI/HPC at ECTC 2026, Revolutionizing CPO with High-Performance Detachable Optical Connectors
Intel Foundry USA Overview Intel Foundry engineers presented advanced packaging technologies at ECTC 2026, redefining AI and HPC scalability limits. They demonstrated scaling of EMIB-T packaging and showcased innovations in Co-Packaged O... -
New Technology
Samsung and Intel Pioneer Low-Warpage Solutions for Advanced Electronics Packaging, Boosting Reliability
PatSnap Eureka Global Overview Samsung and Intel are spearheading efforts to reduce warpage in electronics packaging components. Samsung leverages its I-Cube technology and optimized package stack designs to match thermal expansion chara... -
Semiconductor Back-End
Glass Substrates Emerge as Next-Generation Solution to AI Chip Packaging Bottleneck
TrendForce Taiwan Overview Glass substrates are gaining significant traction as a next-generation material poised to overcome the limitations of traditional organic substrates and resolve critical bottlenecks in AI chip packaging. Offeri... -
Photonics
AI Data Center Optical Interconnect Market Surges with CPO, Silicon Photonics, and NTT’s IOWN Initiative
openPR.com USA Overview The market for optical interconnects in AI data centers is surging due to the essential need for ultra-high-speed optical links in GPU-dense AI clusters, where bandwidth directly impacts model training efficiency.... -
Semiconductor Back-End
ABF Substrate Becomes Critical Bottleneck in AI Hardware Supply Chain, Driven by Ajinomoto’s Dominance
専門メディア (分析) Taiwan Overview Ajinomoto Build-up Film (ABF), an essential insulating dielectric for high-performance substrates, has emerged as an unexpected bottleneck in the AI hardware ecosystem due to Ajinomoto Fine-Techno's ne... -
Photonics
Broadcom Unveils VMware Cloud Foundation 9.1 to Enhance Cost-Efficiency and Security for Production AI in Private Clouds
Storage Newsletter USA Overview Broadcom has announced VMware Cloud Foundation (VCF) 9.1, a secure and cost-effective infrastructure platform engineered for production AI workloads. VCF 9.1 provides an AI and Kubernetes-native private cl...