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Applied Materials Unveils New ALD and Selective Etch Systems to Advance 3D Chip Scaling
Stock Titan (Company Press Release) USA Overview Applied Materials announced new deposition (Centris Spectral SiN ALD) and selective etch systems to advance 3D chip scaling. The Centris Spectral SiN ALD system is designed for uniform, lo... -
Analytical Framework for Twisted 2D Materials Accelerates High-Speed, Energy-Efficient Memristors and Neuromorphic Computing
National Science Review (Oxford Academic) International Overview A new analytical framework has been presented to understand twisted 2D materials. The ability to scale 2D materials down to a single layer holds significant promise for dev... -
Tensordyne’s Napier AI Inference System, Taped Out on TSMC 3nm, Achieves 17x More Tokens/Watt and 13x Higher Throughput than NVIDIA Blackwell
Tensordyne USA Overview Tensordyne announced its Napier (TDN) AI inference system, fabricated on TSMC's 3nm process, delivers up to 17x more tokens per watt and 13x higher throughput compared to NVIDIA Blackwell systems. This breakthroug... -
OpenAI Boosts ChatGPT’s ‘Dreaming’ Memory, Partners with Oracle, Targets IPO with Reported $965 Billion Valuation
OpenAI Newsroom USA Overview OpenAI announced a significant enhancement to ChatGPT's memory capabilities, dubbed 'Dreaming,' to deliver more personalized conversational experiences. Concurrently, the company revealed a strategic partners... -
Intel Foundry Unveils Advanced Packaging Innovations for AI/HPC at ECTC 2026, Revolutionizing CPO with High-Performance Detachable Optical Connectors
Intel Foundry USA Overview Intel Foundry engineers presented advanced packaging technologies at ECTC 2026, redefining AI and HPC scalability limits. They demonstrated scaling of EMIB-T packaging and showcased innovations in Co-Packaged O... -
Atomic Precision Unleashed: ALD and ALE Drive Next-Gen Semiconductor Miniaturization and Performance
ELE Times India Overview Atomic Layer Deposition (ALD) and Atomic Layer Etching (ALE) are emerging as critical nanoscale processes essential for advancing next-generation semiconductor device miniaturization and performance. These techno... -
Nanoimprint Lithography Poised to Revolutionize Nanoscale Device Fabrication Below 10nm
AZoNano Australia Overview Nanoimprint Lithography (NIL) offers a groundbreaking alternative to traditional photolithography, enabling direct mechanical patterning at the nanoscale without relying on light or electron beam exposure. This... -
Samsung Foundry Secures Optical Module Order, Ramps Up Silicon Photonics and CPO Drive for AI
TrendForce South Korea Overview Samsung Foundry has reportedly secured a significant optical module order, signaling an intensified focus on silicon photonics and Co-Packaged Optics (CPO). The company aims to differentiate itself by offe... -
NTT’s IOWN DCI Rack Solution Launches in Japan: Optical Tech to Resolve AI Data Center Power, Heat, and Latency Issues
PR TIMES Japan Overview Itochu Techno-Solutions (CTC), APRESIA Systems, and Edgecore Networks Corporation have partnered to deploy the "IOWN DCI Rack Solution" in Japan, based on NTT's IOWN concept. This solution fundamentally redefines ... -
ALD Breakthroughs Propel 2nm Logic and AI Hardware: Molybdenum Contacts and Ferroelectric TiO2 Unveiled
Atomic Layer Deposition USA Overview Atomic Layer Deposition (ALD) is entering a "supercycle" driven by 2nm logic and AI hardware demand, with Applied Materials introducing a Spectral™ ALD system that reduces transistor contact resistanc...
