OSAT– tag –
-
SiC Power Modules Get a Boost: Advanced Packaging with AMB and Embedded Die Transforms EV and AI Data Centers
[Industry Publication/Research] Global Overview Advanced packaging technologies for Silicon Carbide (SiC) power modules are dramatically improving thermal management and power density in electric vehicle (EV) inverters and AI data center... -
Amkor to Invest $7 Billion in Arizona for Advanced AI Chip Packaging, Shifts Korean SiP Production to Vietnam
Seeking Alpha USA Overview Amkor Technology is making a monumental $7 billion investment to construct an advanced packaging and test campus in Arizona, slated for production by early 2028, to address the escalating demand for AI chips. T... -
NVIDIA Commits $1.5B Prepayment to Amkor for U.S. AI Chip Advanced Packaging Expansion by 2028
ETElectronics USA Overview NVIDIA is investing $1.5 billion in Amkor Technology through an upfront payment to significantly expand its advanced packaging capacity for AI chips in the U.S. This strategic partnership ensures NVIDIA's acces... -
PM Modi Inaugurates Kaynes Semicon’s ₹33 Billion OSAT Facility in Gujarat, Targeting 2.3 Billion Chips Annually and 5,000 Jobs
YouTube (ANI News) India Overview Indian Prime Minister Narendra Modi announced the inauguration of Kaynes Semicon's OSAT (Outsourced Semiconductor Assembly and Test) facility in Sanand, Gujarat, which commenced commercial production on ... -
India’s Semiconductor Ecosystem Rapidly Expanding: Government Commits ₹1.275 Trillion for Semicon 2.0, First ATMP/OSAT Facility Operational
Asia Briefing India Overview India's semiconductor manufacturing ecosystem is rapidly expanding in 2026, with 13 approved semiconductor projects currently operational or under development, including the launch of the first ATMP/OSAT faci... -
Indian State of Madhya Pradesh Signs MoU for ₹6,200 Crore OSAT Facility with Paras Semiconductors, Advancing Heterogeneous Integration and 3D Packaging
ET Government India Overview The government of Madhya Pradesh, India, announced a Memorandum of Understanding with Paras Semiconductors to establish an advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly and Test) fa... -
Yole Group Forecasts Advanced Packaging Market to Double to Over $120 Billion by 2031, Driven by AI and HPC Demand
Yole Group (via advancedpackaging.news) France Overview Yole Group's latest report projects the global advanced packaging market to more than double from $55 billion in 2025 to over $120 billion by 2031, fueled by next-generation AI and ... -
Malaysia Launches RM92 Million Government-Backed Initiative to Develop HBM4 Advanced Packaging Pilot Line, Targeting Higher Semiconductor Value Chain
Business News Malaysia Overview Malaysia is aggressively pursuing a strategy to elevate its position in the semiconductor value chain by focusing on IC design and advanced packaging. The Malaysia Advanced Packaging Consortium (MAPC), est... -
Taiwan’s TGV Glass Substrate Supply Chain Advances: E&R Engineering Ships Laser Modification Equipment to US Client, Accelerating Mass Production
Taiwan News Taiwan Overview Driven by escalating HPC demand, glass substrates are emerging as a next-generation advanced packaging solution, leading to the formation of a robust Through-Glass Via (TGV) supply chain in Taiwan. E&R Eng... -
CoWoS Identified as Core Bottleneck for AI GPU Shipments, Distinct from HBM Shortage
BiyaPay Blog International Overview CoWoS (Chip-on-Wafer-on-Substrate) is an advanced packaging technology integrating GPUs, HBM, and chiplets; its limited capacity forms a critical manufacturing integration bottleneck for AI GPU shipmen...
