OSAT– tag –
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Amkor Bolsters U.S. Semiconductor Ecosystem with Over $7 Billion Investment in Arizona Advanced Packaging Facility
Amkor USA Overview Amkor Technology is dramatically escalating its commitment to a new advanced packaging and test facility in Peoria, Arizona, increasing its investment from an initial $2 billion to over $7 billion. This strategic expan... -
ASE to Raise Advanced Packaging Prices by Up to 20% by 2026 Amid Soaring AI Demand
AXTEK Technology Company Limited Taiwan Overview ASE Technology Holding, the world's largest OSAT provider, plans to increase its backend wafer packaging prices by 5-20% in 2026, driven by a surge in AI-powered semiconductor demand. With... -
Amkor Technology Acquires 67 Additional Acres in Arizona, Expanding U.S. Advanced Packaging Footprint
Dataquest Bureau USA Overview Amkor Technology has secured an additional 67 acres adjacent to its existing campus in Peoria, Arizona, to significantly expand its U.S. advanced semiconductor packaging and test capabilities. This strategic... -
AMD Announces Over $10 Billion Taiwan Ecosystem Investment to Bolster AI Infrastructure and Advanced Packaging Manufacturing
Electronics Engineering Herald - EEHerald USA Overview AMD announced an investment exceeding $10 billion in Taiwan's ecosystem to expand its AI infrastructure and advanced packaging manufacturing capabilities. This significant capital in... -
Malaysia Launches National Consortium to Accelerate Advanced Semiconductor Packaging Development Within Two Years
SME.asia Malaysia Overview Malaysia has established the Malaysia Advanced Packaging Consortium (MAPC) with a total funding of RM185 million ($39 million USD) to develop domestic advanced semiconductor packaging capabilities within two ye... -
Amkor Technology Targets $11B Revenue by 2030, Anchored by $7 Billion Arizona Advanced Packaging Investment
MarketBeat USA Overview Amkor Technology aims to exceed $11 billion in revenue by 2030, driven by a $7 billion, two-phase investment in its Arizona advanced packaging and test campus. High-volume manufacturing is slated to begin in 2028,... -
ASE Technology Boosts Advanced Packaging Investment to Record $8.5 Billion Amid Surging AI Demand
digitimes Taiwan Overview ASE Technology Holding, the world's largest chip packaging and test company, has significantly raised its 2026 capital expenditure to a record $8.5 billion, driven by surging demand for AI chips. The company pro... -
ASE and WUS Announce Strategic Alliance for Advanced AI Packaging Hub in Kaohsiung with NT$35 Billion Investment
ASE Technology Holding Co., Ltd. Taiwan Overview ASE Technology Holding and WUS Printed Circuit have unveiled a strategic collaboration to construct a state-of-the-art manufacturing facility in Kaohsiung, Taiwan, backed by an investment ... -
TSMC Accelerates CoWoS and SoIC Expansion to Quell AI Chip Bottleneck, Targets 4x Capacity by 2026
FinancialContent - Stock Market Taiwan Overview TSMC is aggressively expanding its CoWoS and SoIC advanced packaging capacity to address the soaring demand for AI chips, aiming to increase monthly wafer output from approximately 35,000 u... -
Amkor Technology Secures CHIPS Act Funding, Expands U.S. Advanced Packaging Footprint in Arizona
Amkor Technology (via Business Wire) USA Overview Amkor Technology is significantly boosting its U.S. advanced packaging and test capabilities by acquiring an additional 67 acres adjacent to its existing 104-acre campus in Peoria, Arizon...
