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ASE’s SPIL Nears Arizona Back-End Test Facility Expansion Amidst $10.5B CAPEX Surge; Amkor Boosts US Packaging Investment to $12B
TrendForce Taiwan Overview ASE subsidiary SPIL is finalizing plans for a new back-end test facility in Arizona, part of ASE's $10.5 billion CAPEX for 2026, which includes $4 billion for new facilities and $6.5 billion for equipment. Conc... -
Nvidia Chip Sales Projected to Double Next Year, Accelerating HBM4 Transition Amid TSMC CoWoS Packaging Bottleneck
No source name USA Overview Nvidia CEO Jensen Huang forecasts a doubling of Nvidia chip sales next year and an accelerated transition to HBM4, with TSMC's CoWoS advanced packaging identified as a primary shipping bottleneck. CoWoS is cru... -
TSMC to Double CoWoS Advanced Packaging Capacity to 260,000 Wafers/Month by 2028, Driving OSAT and Intel Orders Amid Supply Crunch
BigGo Finance Taiwan Overview TSMC plans to double its CoWoS advanced packaging capacity from 130,000 wafers/month to 260,000 wafers/month by the end of 2028, primarily driven by surging AI chip demand. This expansion, centered on its AP... -
NXP Unveils Plan to More Than Double Malaysian Semiconductor Back-End Capacity Amid Surging Global Demand
Japanese Semiconductor Manufacturing Equipment Malaysia Overview NXP has announced a substantial expansion of its Malaysian facility, targeting a more than twofold increase in semiconductor back-end production capacity. This strategic in... -
Amkor Technology and NVIDIA Announce $1.5 Billion Advanced Packaging Partnership to Accelerate AI Multi-Die Integration
IMAPS 3D InCites Content Platform USA Overview Amkor Technology and NVIDIA announced a multi-year partnership in July 2026, including a $1.5 billion advanced packaging and development agreement, to drive next-generation technology for AI... -
AI Boom Spurs China’s Top OSATs to Pour Billions into Advanced Packaging
Digital Today China Overview China's three leading OSAT firms—JCET, Tongfu Microelectronics, and Huatian Technology—have reported significant profit surges in H1 2026, largely due to escalating AI semiconductor demand. In response, these... -
Powertech Aims for Early 2027 Launch of World’s First AI Server Panel-Level Packaging Mass Production
Tonarism Taiwan Overview Powertech Technology, a leading Taiwanese OSAT, has unveiled plans to commence mass production of panel-level packaging (PLP) for AI semiconductors and server CPUs by early 2027. This initiative establishes the w... -
Taiwan’s OSATs Boost AI Capacity with $14.4B Capex; ASE Deepens TSMC CoWoS Collaboration to Meet Soaring Demand
Domino Theory Taiwan Overview Five leading Taiwanese chip packaging and test companies plan a record $14.4 billion (NT$460 billion) in capital expenditures this year to meet surging AI chip demand, matching TSMC's own advanced packaging ... -
Glass Substrates in Advanced Packaging Accelerate from Prototype to Mass Production, Emerging as Key Technology for HBM and Chiplet Integration
Solid State Technology USA Overview Advanced packaging technology utilizing glass substrates is rapidly transitioning from R&D to mass production within the semiconductor industry. Glass substrates, superior to conventional organic s... -
Onto Innovation Unveils High-Precision, High-Speed Metrology Solution to Accelerate Panel Level Packaging Mass Production
Photonics.com USA Overview Onto Innovation has announced a high-precision metrology solution designed to overcome mass production challenges in Panel Level Packaging (PLP). This new technology enables high-speed measurement of fine struc...
