OSAT– tag –
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Morgan Stanley Raises CoWoS Demand Forecast to 2.69 Million Wafers by 2027, Citing CPUs and ASICs as New Drivers
Industry Analysis / Moomoo Unknown Overview Morgan Stanley has significantly raised its demand forecast for TSMC's CoWoS packaging, projecting it to reach 2.69 million wafers annually by 2027. CPUs and ASICs are emerging as new key drive... -
TSMC’s CoWoS Packaging Capacity Identified as Bottleneck in Korea’s HBM4E Race, Despite SK hynix and Samsung Shipments
Aju Press South Korea Overview Despite SK hynix and Samsung Electronics commencing sample shipments of 12-layer HBM4E chips to major customers like Nvidia, TSMC's CoWoS advanced packaging capacity is highlighted as the true bottleneck in... -
Morgan Stanley: TSMC AI Revenue to Triple by 2027, CoWoS Packaging Remains Critical Bottleneck
HTX Insights (Morgan Stanleyレポート引用) International Overview A new report from Morgan Stanley forecasts TSMC's AI-related revenue to surge by 218% to $86.3 billion by 2027, up from $27.1 billion in 2026. However, this explosive growt... -
ASE Technology Holding Raises 2026 Capex to $8.5 Billion Driven by Surging AI Advanced Packaging Demand, Launches 15 Expansion Projects in Taiwan & Malaysia
SemiMedia Taiwan Overview ASE Technology Holding, the world's largest OSAT provider, has significantly increased its 2026 capital expenditure plan from $7 billion to $8.5 billion, a 21.4% jump, driven by robust demand from AI servers, HP... -
Amkor Supercharges U.S. Chip Packaging with 67-Acre Arizona Expansion, Aiming for First High-Volume Advanced OSAT
StocksToTrade USA Overview Amkor Technology has significantly expanded its U.S. presence by acquiring an additional 67 acres at its advanced packaging and test campus in Peoria, Arizona. This strategic move targets establishing the natio... -
TSMC and Amkor Forge 10-Year Strategic Partnership to Boost U.S. Advanced Packaging Capabilities
Focus Taiwan Taiwan Overview TSMC and Amkor Technology have entered a 10-year strategic agreement to bolster advanced semiconductor packaging in the United States. Under this pact, TSMC will procure advanced packaging and test services f... -
Kaynes Technology Partners with Japan’s AOI Electronics to Build ₹3,307 Cr OSAT Plant in India, Boosting Semiconductor Back-End Capabilities
Sahi India Overview Kaynes Technology's subsidiary has formally partnered with Japanese OSAT leader AOI Electronics for a ₹3,307 crore (approx. $395 million USD) Sanand OSAT facility, slated for commercial operation in H2 2026. This coll... -
TSMC to Halve AI Chip Supply Gap from 20% to 10% by End-2026 with CoWoS Capacity Boost; Next-Gen CoPoS on Track
TrendForce Taiwan Overview TSMC is projected to halve the AI chip supply-demand gap from approximately 20% to 10% by the end of 2026 through aggressive expansion of its CoWoS advanced packaging capacity. The company's monthly CoWoS produ... -
AI Infrastructure Demand Intensifies Memory Shortage: TSMC CoWoS Constraints and Vietnam Labor Shortages Create Compound Challenges
Sourceability USA Overview Rising AI infrastructure demand is generating new challenges across the semiconductor supply chain, notably a worsening memory shortage. TSMC's CoWoS packaging limitations are expected to persist with the AI bo... -
Samsung, SK Hynix Eye Honam Region in South Korea for First Advanced Packaging Fabs Amid Soaring AI Memory Demand; Amkor Plans $980M Expansion
The Elec Inc. South Korea Overview Samsung Electronics and SK Hynix are considering establishing their first advanced semiconductor packaging plants in South Korea's Honam region to meet surging AI infrastructure demand. Samsung is weigh...
