OSAT– tag –
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TSMC’s CoWoS Supply to Reach At Least 200K Wafers Monthly by 2027, Accelerating Expansion to Meet Soaring AI Demand
DigiTimes Taiwan Overview TSMC is accelerating its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging capacity expansion to meet robust AI chip demand, with market indications suggesting monthly output will reach at least 200,000 wafe... -
Morgan Stanley Forecasts 93% CoWoS Demand Surge by 2027, Driven by AMD’s Venice CPU Shipments
KuCoin International Overview Morgan Stanley forecasts global CoWoS (Chip-on-Wafer-on-Substrate) demand to nearly double to 2.694 million wafers in 2027, a 93% increase from 1.394 million in 2026. This growth is predominantly driven by A... -
Amkor Technology Expands Arizona Campus with 67-Acre Acquisition, Bolstering U.S. Advanced Packaging OSAT Capacity
AllMind AI News USA Overview Amkor Technology has acquired an additional 67 acres in Arizona to significantly expand its U.S. advanced semiconductor packaging and test capacity. This expansion, supported by up to $407 million in CHIPS Ac... -
Advanced Packaging Becomes the New Bottleneck for AI Chip Production, Driving Global Capex Race and Nvidia’s Supply Diversification Efforts
The Economy International Overview Advanced packaging, not process technology, is now the primary bottleneck in AI chip production, prompting Nvidia to explore diversifying its CoWoS supply, potentially including Intel's EMIB. This shift... -
Morgan Stanley Forecasts 93% Surge in CoWoS Demand by 2027, Anticipates AMD Venice CPU Adoption
Phemex News USA Overview Morgan Stanley projects a staggering 93% surge in global demand for CoWoS (Chip-on-Wafer-on-Substrate) technology by 2027, reaching 2.694 million units. Nvidia is expected to remain the largest consumer, accounti... -
JCET Shares Soar on Major Investment in Advanced Chip Packaging Capabilities
Morningstar (Dow Jones News) China Overview Shares of China-based OSAT leader JCET Group surged following the announcement of a significant new investment in its advanced chip packaging capabilities. This investment aims to substantially... -
ASE Elevates Advanced Packaging Quotes Over 20% Amid Explosive AI Demand Crunch
SiliconAnalysts Taiwan Overview ASE Technology, the world's largest outsourced semiconductor assembly and test (OSAT) provider, has increased its advanced packaging service prices by over 20%. This hike is a direct response to unpreceden... -
OSAT Vendors Report Strong Q1 2026 Revenue Growth Driven by AI-Related Advanced Packaging Demand: ASE Up 18%, Amkor Up 25%
Counterpoint Research Global Overview The Outsourced Semiconductor Assembly and Test (OSAT) sector recorded robust revenue growth in Q1 2026, fueled by surging AI-driven advanced packaging demand. ASE Technology Holding reported an 18% y... -
TSMC and Amkor Technology Forge 10-Year Strategic Partnership to Expand Advanced Chip Packaging Capabilities in the US
Focus Taiwan USA Overview TSMC and Amkor Technology have entered a 10-year strategic agreement to significantly bolster advanced semiconductor packaging and test capacity in the United States. This partnership aims to expand advanced pac... -
ASE Technology Holding Accelerates AI Chip Production with Major Packaging Expansion, Raises 2026 LEAP Revenue Target to Over $3.5 Billion
Crypto Briefing Taiwan Overview ASE Technology Holding is embarking on a significant global expansion, including 15 new facilities, to address the escalating demand for AI chips. This strategic move, leveraging their LEAP platform and VI...
