Package Substrate– tag –
-
Samsung Electro-Mechanics and Qualcomm Jointly Develop Organic Bridge for Advanced 2.1D AI Semiconductor Packaging
The Elec South Korea Overview Samsung Electro-Mechanics and Qualcomm have collaborated to develop an 'organic bridge' technology for advanced 2.1D packaging in AI semiconductors. This innovation facilitates high-density, high-bandwidth i... -
Glass Substrates & TGV Technology Set to Reshape 2027 Advanced Packaging Race; US, Japan, Korea, Taiwan, China Accelerate Development
digitimes Taiwan Overview As AI chip package sizes expand, glass substrates and Through-Glass Via (TGV) technology are emerging as new focal points in advanced packaging competition. Supply chain leaders in the US, Japan, South Korea, Ta... -
AI Infrastructure Component Crunch Becomes Reality: ABF Substrate Lead Times Hit 56 Weeks, Equipment Parts Up to 40 Months
BigGo Finance Taiwan Overview The supply shortage for AI infrastructure components is becoming entrenched; TrendForce reports ABF substrate lead times surged to 48–56 weeks, approximately 4 to 4.7 times the equilibrium. HDDs reached 50 w... -
Samsung Electro-Mechanics Unveils Next-Gen Package Substrate Technologies for AI & Servers at KPCA Show 2026, Highlighting Warp Reduction & High-Density Interconnects
Samsung Electro-Mechanics South Korea Overview Samsung Electro-Mechanics showcased a comprehensive suite of next-generation semiconductor package substrate technologies targeting the AI and server markets at 'KPCA Show 2026.' The company... -
AI Accelerator ABF Substrate Shortage to Exceed 40% by 2028; Ibiden, Unimicron, Samsung Electro-Mechanics Rush Billions in Capacity Expansion
Tom's Hardware Japan Overview The supply shortage of ABF (Ajinomoto Build-up Film) substrates for AI accelerators is projected to worsen significantly, potentially reaching approximately 10% by late 2026, 21% by 2027, and over 40% by 202... -
Google Reportedly Considering CoWoS as Backup for 2027 TPUs Amid Intel EMIB-T Substrate Yield Lag Reports
No source name USA Overview Google's Humufish TPU project, slated for mass production by late 2027, is reportedly considering TSMC's CoWoS as a backup packaging solution, following reports of lagging substrate yields for Intel's EMIB-T t... -
High-End ABF Substrate Supply Faces Critical Shortage Amid Gigantic AI Chip Growth, Fueling Intense Competition Among Taiwanese Manufacturers
Tom's Hardware Taiwan Overview The escalating computational power and physical size of AI chips have led to a severe global shortage in the supply of high-end Ajinomoto Build-up Film (ABF) substrates, a core component. In response, inten... -
Samsung Electro-Mechanics Unveils Five Next-Gen Semiconductor Package Substrate Products for AI, Automotive, and Mobile Markets at KPCA Show
Global Sources South Korea Overview Samsung Electro-Mechanics showcased next-generation semiconductor package substrate technologies at KPCA Show, targeting high-end chip applications like AI servers, automotive systems, and mobile devic... -
Unimicron Reports 90% Surge in Equipment Demand from AI, Japanese SME Dependence on ABF Substrates Creates Bottleneck
BigGo Finance Taiwan Overview Unimicron Technology Chairman Chien Shan-Chieh stated that escalating AI demand has severely impacted the substrate sector, worsening supply-demand imbalance due to heavy reliance on small and medium-sized J... -
Dell Reports Record Q2 Revenue of $47 Billion with $95 Billion AI Server Backlog; Entire Supply Chain, Including DRAM, HBM, ABF Substrates, at ‘Redline’
KuCoin International Overview Dell reported record Q2 revenue of $47 billion and an impressive $95 billion backlog for AI servers. However, Dell executives stated that the entire supply chain, including DRAM, NAND, specific CPUs, mature ...
