Package Substrate– tag –
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Glass Core Substrates Emerge as Next-Gen AI/HPC Packaging Technology, Face Commercialization Hurdles in Brittleness and TGV Formation
Pandaily China Overview Glass core substrates are garnering significant attention in the semiconductor packaging industry, driven by escalating performance demands in AI chips, HPC, and advanced processor packaging. They offer superior d... -
TSMC Strengthens Glass Substrate Supply Chain for CoWoS, Achieving 16% Warpage Reduction for High-Performance AI GPUs
Wccftech USA Overview TSMC is expanding its glass substrate supply chain for advanced CoWoS packaging, collaborating with Innolux and Ibiden. Glass substrates demonstrate a 16% reduction in package warpage, along with improved thermal ex... -
ABF Substrates Become AI Accelerator Bottleneck, Nvidia’s H100 Requires 12+ Layers; Glass Substrates Emerge as Next-Gen Solution, Commercialization Years Away
Data Gravity USA Overview Ajinomoto Build-up Film (ABF) substrates are a critical component and growing bottleneck in AI accelerators, HBM, and chiplet-based designs. Nvidia's H100 GPU demands over 12 layers of ABF, with the Blackwell B2... -
AT&S Unveils €2 Billion Kulim Expansion to Fuel AI Boom with Advanced IC Substrates and PCBs
AT&S Official Press Release オーストリア Overview AT&S is undertaking a monumental €1.5 billion to €2 billion expansion of its Kulim, Malaysia, manufacturing facility. Driven by long-term commitments from industry leaders like AMD, t... -
Glass Substrates: The Next Frontier in AI Packaging and the Race to Mass Production
The Economy South Korea Overview Glass substrates are rapidly emerging as a transformative technology in advanced AI chip packaging, poised to replace conventional organic substrates and silicon interposers by offering superior dimension... -
Ibiden and Unimicron Unveil Over $5 Billion Investment to Dramatically Expand AI Server ABF Substrate Production
Next Financial Japan Overview Japanese Ibiden and Taiwanese Unimicron are jointly investing over ¥800 billion (approximately $5 billion USD) to significantly increase production capacity for high-performance ABF (Ajinomoto Build-up Film)... -
Intel to Build $3.3 Billion Glass Core Substrate Manufacturing Facility in India to Bolster Advanced Packaging Supply
TrendForce USA Overview Intel, in collaboration with 3D Glass Solutions (3DGS), is progressing with plans to invest approximately $3.3 billion in an advanced packaging glass core substrate manufacturing facility in Odisha, India. The pla... -
Glass Substrates Emerge as Next-Generation Solution to AI Chip Packaging Bottleneck
TrendForce Taiwan Overview Glass substrates are gaining significant traction as a next-generation material poised to overcome the limitations of traditional organic substrates and resolve critical bottlenecks in AI chip packaging. Offeri... -
Samsung Electro-Mechanics and Sumitomo Chemical Group Partner to Establish Glass Core Substrate Joint Venture
企業発表 South Korea Overview Samsung Electro-Mechanics and Sumitomo Chemical Group have signed an MOU to establish a joint venture for manufacturing "glass core" substrates, a critical material for next-generation advanced packaging. Ai... -
ABF Substrate Becomes Critical Bottleneck in AI Hardware Supply Chain, Driven by Ajinomoto’s Dominance
専門メディア (分析) Taiwan Overview Ajinomoto Build-up Film (ABF), an essential insulating dielectric for high-performance substrates, has emerged as an unexpected bottleneck in the AI hardware ecosystem due to Ajinomoto Fine-Techno's ne...
