Package Substrate– tag –
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ABF Substrates Emerge as the True Bottleneck in the AI Era, More Critical Than DRAM for High-Performance Computing
Industry Analysis International Overview ABF (Ajinomoto Build-up Film) substrates, not DRAM, are becoming the more critical bottleneck in the AI supply chain. Leading manufacturers like Ibiden and Unimicron are poised to benefit directly... -
Global ABF Substrate Shortage to Persist Through 2028 Due to Soaring AI Demand, Impacting High-End Chip Production
DigiTimes Taiwan Overview The global market for ABF (Ajinomoto Build-up Film) substrates is projected to remain in shortage through 2028, driven by escalating demand for AI hardware. This scarcity directly impacts the production of high-... -
Advanced Packaging Becomes the New Bottleneck for AI Chip Production, Driving Global Capex Race and Nvidia’s Supply Diversification Efforts
The Economy International Overview Advanced packaging, not process technology, is now the primary bottleneck in AI chip production, prompting Nvidia to explore diversifying its CoWoS supply, potentially including Intel's EMIB. This shift... -
AT&S Transforms Austrian Fehring Plant into Innovation Hub with €10M Investment, Bolstering Advanced PCB & Thermal Solutions
AT&S (Press Release) Austria Overview AT&S, a global leader in high-end PCBs and IC substrates, is investing approximately €10 million in its Fehring plant in Austria. This strategic upgrade aims to establish the facility as an innov... -
AT&S Initiates High-Volume AI Substrate Production in Malaysia, Backed by Major Customer Commitments and Projecting Substantial Revenue Growth
boerse-social.com Austria Overview AT&S, a leading Austrian manufacturer of high-end IC substrates, has commenced high-volume production of advanced AI substrates at its new Kulim, Malaysia, facility. This expansion, supported by lon... -
EU Chips Act Funds €210 Million for 3D IC Advanced Packaging, Benefiting Infineon, ASML Subsidiary, and Soitec
Qishuai-cn Germany Overview The European Commission announced its first EU Chips Act-funded project, allocating a total of €210 million to Germany's Infineon, an ASML subsidiary in the Netherlands, and France's Soitec. This funding is de... -
AI Packaging Bottleneck Shifts: CoWoS, Wafer-Scale, and CoWoP Emerge as Key Solutions
EDN USA Overview The packaging bottleneck hindering AI chip performance is being addressed by advanced technologies such as CoWoS, wafer-scale packaging, and CoWoP. These innovations optimize the integration of AI processors and HBM by e... -
TSMC Accelerates CoPoS Packaging with Glass Core Substrates: Targets 30% Cost Reduction, >90% Wafer Utilization Post-2028
Wccftech / CHOSUNBIZ / BigGo Finance Taiwan Overview TSMC is accelerating the development of CoPoS packaging, a successor to CoWoS, leveraging glass core substrates co-developed with Ibiden and Innolux. This panel-level packaging approac... -
AT&S Commits €2 Billion to Accelerate AI/HPC Chip Substrate Production in Asia, Bolstered by AMD Partnership
TNW オーストリア Overview Austrian IC substrate manufacturer AT&S is investing €1.5-2 billion to significantly expand high-end IC substrate capacity at its Kulim, Malaysia, and Chongqing, China, facilities. This strategic move, drive... -
AT&S Commits €2 Billion to Malaysian Expansion, Supercharging AI IC Substrate Capacity for AMD and Key Tech Partners
EQS News オーストリア Overview Austrian IC substrate manufacturer AT&S is undertaking a significant €1.5-2 billion expansion of its Kulim, Malaysia plant to dramatically increase high-end IC substrate production for AI and high-perfo...
