Package Substrate– tag –
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TSMC SVP Reports 90% Surge in Equipment Orders in Six Months Driven by AI Demand: Equivalent to Building 20 Fabs Globally Simultaneously
TechSoda Taiwan Overview TSMC Senior VP Cliff Hou reported an astonishing 90% surge in equipment orders over six months, driven by AI demand far exceeding forecasts, equivalent to constructing nearly 20 fabs worldwide simultaneously. Uni... -
Simmtech to Invest 400 Billion Won in Next-Gen AI Server Substrate Production: Capacity Expansion Starts 2028
The Elec Inc. South Korea Overview Simmtech announced a phased 400 billion won (approx. $300 million) investment to expand production capacity for next-generation substrates used in AI servers. New facilities in Cheongju will boost outpu... -
TRUMPF Resolves Glass Substrate TGV Coating Bottleneck with High-Power HiPIMS, Accelerating Next-Gen AI Chip Packaging
TRUMPF Germany Overview TRUMPF has introduced a High-Power Impulse Magnetron Sputtering (HiPIMS) approach to address a key manufacturing challenge in next-generation AI chip packaging: reliably coating millions of minute Through-Glass Vi... -
High-End ABF Substrate Shortage Intensifies Due to Massive AI Chips: Taiwanese Makers & Equipment Suppliers Face Fierce Competition
Medium (by Julien Nauy) International Overview The high-end ABF (Ajinomoto Build-up Film) substrate market for AI chips faces a severe supply shortage, reflecting a 're-evaluation of manufacturing difficulty' distinct from traditional AB... -
Korean Tech Giants Accelerate AI Substrate Production Amid Soaring Demand, Nearing 90% Utilization
TrendForce Taiwan Overview The proliferation of AI data centers has created a critical shortage and driven up prices for advanced substrates essential for GPUs and HBM. In response, Samsung Electro-Mechanics (SEM) and LG Innotek are aggr... -
Glass Substrates Emerge as Key Breakthrough for Next-Gen AI Chip Packaging: Intel, TSMC, Samsung Accelerate Development
Industry Analyst International Overview Glass substrates are increasingly recognized as a critical breakthrough for next-generation AI chip packaging, with industry leaders like Intel, TSMC, and Samsung Electro-Mechanics accelerating the... -
Glass Substrates in Advanced Packaging Accelerate from Prototype to Mass Production, Emerging as Key Technology for HBM and Chiplet Integration
Solid State Technology USA Overview Advanced packaging technology utilizing glass substrates is rapidly transitioning from R&D to mass production within the semiconductor industry. Glass substrates, superior to conventional organic s... -
AT&S Ramps Up HPC Substrate Capacity to Meet Surging Data Center and AI Demand
Business Journal Austria Overview Austrian-based AT&S, a leading package substrate manufacturer, is significantly accelerating its IC substrate capacity expansion, primarily targeting high-performance computing (HPC) applications. Th... -
Ajinomoto Fine-Techno to Expand ABF Film Production Capacity, Anticipates Easing AI Chip Supply Shortages by Early 2027
The Wall Street Journal Japan Overview Ajinomoto Fine-Techno disclosed plans to significantly boost its production capacity for Ajinomoto Build-up Film (ABF) film across multiple manufacturing sites, driven by exploding demand for AI chi... -
Shinko Electric Industries Expands High-Density Package Substrate Supply to European Automotive and Industrial Clients, Targeting Automotive AI Demand
Japan Times Japan Overview Shinko Electric Industries announced an expanded supply of high-density package substrates to European automotive and industrial equipment manufacturers. The company’s robust and reliable packaging technology i...
