Rapidus– tag –
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Japan Introduces New Subsidy Program for Advanced Packaging R&D, Focusing on Heterogeneous Integration and 3D Stacking to Enhance Competitiveness
METI Press Release Japan Overview Japan's Ministry of Economy, Trade and Industry (METI) unveiled a new subsidy program to support R&D and mass production investment in advanced packaging technologies for strengthening the domestic s... -
Rapidus Targets 600mm Panel-Level Packaging and 8-Reticle Interposers by 2030 for Advanced AI/HPC Systems
TrendForce Japan Overview Rapidus announced an accelerated advanced packaging roadmap aiming for 600mm panel-level packaging and 8-reticle interposers by 2030. The company has fully activated its Rapidus Chiplet Solutions (RCS) pilot lin... -
Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design, Driving System-Level Co-Optimization
Las Vegas Sun USA Overview Japan's Rapidus announced a partnership with Cadence to drive system-level co-optimization for Agentic AI-enabled advanced SoC (System-on-Chip) design. This collaboration emphasizes tight integration across sem... -
Japan’s Rapidus Partners with IBM on 2nm Semiconductor Manufacturing to Bolster Indo-Pacific Supply Chain Resilience
Geopolitical Analysis / Think Tank International Overview Japan's Rapidus, in partnership with IBM, aims to establish 2nm advanced semiconductor manufacturing in Japan, strengthening the Indo-Pacific supply chain, including ASEAN countri... -
Rapidus to Establish 2nm AI Chip Mass Production by 2027, Bolstering Japan’s Semiconductor Ecosystem
DataM Intelligence International Overview Japan's Rapidus, backed by government and private funding, aims to establish domestic 2nm advanced semiconductor manufacturing and mass produce AI chips by 2027. This initiative will stimulate de... -
Glass Substrates: The Next Frontier in AI Packaging and the Race to Mass Production
The Economy South Korea Overview Glass substrates are rapidly emerging as a transformative technology in advanced AI chip packaging, poised to replace conventional organic substrates and silicon interposers by offering superior dimension... -
Rapidus Explores Panel-Level Packaging on Glass Substrates for Next-Gen AI/HPC Processors
Tom's Hardware Japan Overview Japanese semiconductor firm Rapidus is actively exploring the adoption of panel-level packaging (PLP) on large 600mm x 600mm glass panels for manufacturing high-end multi-chiplet processors designed for AI a... -
Rapidus to Launch Advanced Packaging Pilot Line in Hokkaido by Spring 2026, Accelerating AI Chip Development
Sic-chip.com (via Digitimes) Japan Overview Japanese semiconductor manufacturer Rapidus is accelerating the development of advanced packaging solutions for AI chips, with plans to commence pilot production at its advanced packaging line ... -
Japan’s Rapidus and LSTC Launch Optoelectronic Advanced Packaging Project to Cut AI Chip Power Consumption
creating nano technologies inc. (via Digitimes) Japan Overview Japan's next-generation semiconductor manufacturer Rapidus, in collaboration with the Leading-edge Semiconductor Technology Center (LSTC) and other institutions, has initiate... -
Glass Substrates Emerge as Next-Generation Solution to AI Chip Packaging Bottleneck
TrendForce Taiwan Overview Glass substrates are gaining significant traction as a next-generation material poised to overcome the limitations of traditional organic substrates and resolve critical bottlenecks in AI chip packaging. Offeri...
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