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Ring PCB Details Advanced Thermal Management for High-Power PCBAs: Strict TIM Application, Customized Thick Copper Reflow, and High-Density Thermal Via Arrays
Ring PCB China Overview Ring PCB provides solutions for ensuring thermal stability in high-power Printed Circuit Board Assembly (PCBA) systems through rigorous application of Thermal Interface Materials (TIMs), customized reflow temperat... -
Ajinomoto Fine-Techno Presents Advancements in ABF Film for AI Semiconductor Packaging, Supporting High-Performance Evolution
SEMI Global News Japan Overview Ajinomoto Fine-Techno has announced its latest advancements in ABF (Ajinomoto Build-up Film) technology for AI semiconductor packaging, contributing to higher performance and reliability in AI processors. ... -
Chemical Vapor Deposition (CVD): Key Technology for High-Quality Thin-Film Deposition in the Semiconductor Industry
Wikipedia International Overview Chemical Vapor Deposition (CVD) is a critical thin-film deposition method used to produce high-quality, high-performance solid materials, widely utilized in the semiconductor industry to form conductive l... -
Hoenle Adhesives Launches High-Reliability Underfill ‘Structalit® 8205’ for Miniaturized, High-Density Electronic Assemblies
Adhesives & Sealants Industry (ASI) Germany Overview Hoenle Adhesives has introduced Structalit® 8205, an underfill designed for modern, miniaturized, and high-density electronic assemblies, offering exceptional mechanical stability, the... -
TPO-Free, Low-Viscosity UV-Cure Adhesive “HLC-M-1004” Launched for Medical Devices, Enabling Primerless, Flexible Bonding
Assembly Magazine USA Overview A new TPO-free UV-cure adhesive, "HLC-M-1004," has been introduced for medical device applications, offering low viscosity and strong adhesion to transparent or opaque substrates without a primer. This prod... -
Ajinomoto to Secure ABF Supply Capacity for AI Chip Demand Until 2030, Prioritizing Production Expansion Over Price Hikes
GIGAZINE Japan Overview Ajinomoto announced its capability to meet the surging demand for Ajinomoto Build-Up Film (ABF), a critical interlayer dielectric for advanced semiconductor packaging, until 2030, driven by the exponential growth ... -
Resonac’s Liquid Encapsulant Patent Upheld for 2.5D AI Semiconductor Packages, Ensuring Enhanced Reliability
Resonac Japan Overview Resonac announced that the Japan Patent Office upheld the validity of its Japanese patent (No. 7687499) for a liquid encapsulant critical for 2.5D semiconductor packages in generative AI applications. This technolo... -
Indium Corporation Unveils AuLTRA® 75 Gold-Based Die-Attach Preforms for 5G, Military, and Aerospace GaN Devices at IMS
Industrial Electronics USA Overview Indium Corporation announced it will feature its high-reliability, gold-based precision die-attach preforms at the International Microwave Symposium (IMS). A highlight is AuLTRA® 75, an off-eutectic Au... -
AI Theme Propels Nikkei 225, Driving Significant Gains for Advanced Packaging Material Companies like Resonac and Mitsui Kinzoku
IG Japan Overview The latest Nikkei 225 analysis highlights the significant impact of the AI theme on the market, showing substantial gains for chemical manufacturers like Resonac, a global leader in advanced packaging materials and epox... -
ECTC 2026: Intel Foundry and Amkor Announce Advanced Packaging Technologies for AI/HPC and U.S. Manufacturing Capacity Expansion
Intel Newsroom, Amkor Technology Blog, Semiconductor Engineering USA Overview The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased advanced packaging technologies redefining scalability limits for AI and high-pe...
