Substrate– tag –
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Intel and Lens Technology Form Strategic Alliance to Accelerate Glass Substrate-Based Advanced Semiconductor Packaging for AI Era
Intel Newsroom USA Overview Intel and Lens Technology announced a strategic collaboration to accelerate the development of glass substrate-based packaging solutions for advanced semiconductors, critical for the AI era. This partnership a... -
University of Tokyo Develops CyclicFP-fmoc, a Reversible Adhesive with Strong, Flexible Bonding to Untreated Teflon, Enabling Full Recycling via Ethanol Dissolution
Assembly Magazine Japan Overview Researchers at the University of Tokyo have developed CyclicFP-fmoc, a novel reversible adhesive that forms strong, flexible bonds to untreated Teflon (PTFE) and other fluoroplastics through non-covalent ... -
TSMC and Kinsus Jointly Developing New AI Chip Packaging Technology Akin to Intel’s EMIB to Address CoWoS Capacity Constraints
Tech in Asia Singapore Overview TSMC is reportedly collaborating with Kinsus to develop a novel AI chip packaging technology, resembling Intel's Embedded Multi-die Interconnect Bridge (EMIB), to alleviate the tight supply of CoWoS capaci... -
Master Bond Strengthens Broad USP Class VI Compliant Adhesive Line for Disposable and Reusable Medical Devices, Ensuring Extensive Sterilization Resistance
Master Bond USA Overview Master Bond now offers an enhanced, comprehensive line of high-performance adhesives for disposable and reusable medical device assembly, fully compliant with USP Class VI requirements. This diverse range include... -
Master Bond Launches ISO 10993-5 Biocompatible Dual-Cure Adhesive UV26DCMed, Ideal for Reusable Medical Devices
Adhesives & Sealants Industry USA Overview Master Bond has introduced UV26DCMed, a single-component dual-cure adhesive system for medical device manufacturing, achieving ISO 10993-5 biocompatibility. This innovative material combines rap... -
Hoenle Adhesives Unveils “Structalit 8205” Underfill for Advanced Flip-Chip and BGA Packages, Withstanding 1,000 Thermal Cycles (-40°C to +100°C)
Engineer Live UK Overview Hoenle Adhesives has launched "Structalit 8205", a next-generation underfill material engineered for advanced electronics packaging, demonstrating exceptional thermal cycling resistance. The material successfull... -
Data Insights Reports Forecasts Electronic Circuit Board Underfill Market Growth Driven by Advanced Semiconductor Packaging Demand, Emphasizing Nano-Fillers for Enhanced Thermal Conductivity and Low-Viscosity for Sub-80 µm Bump Pitch
Data Insights Reports India Overview This article is an overview of a market research report provided by Data Insights Reports. The global electronic circuit board underfill market is projected for significant growth, driven by increasin... -
Micro-CT Emerges as Key Non-Destructive 3D Analysis Approach for Semiconductor Package Warpage, Addressing Critical Reliability Challenges
AZoM UK Overview Semiconductor package warpage is a critical issue significantly compromising package performance and reliability. This deformation stems from Coefficient of Thermal Expansion mismatches among package materials (substrate... -
Amkor Technology Presents Large Package Performance Evaluation of Glass Core Substrates for AI and HPC Applications at ECTC 2026
Amkor Technology South Korea Overview Amkor Technology's JongMin Park presented a technical poster on "Large Package Performance Evaluation of Glass Core Substrates for AI and HPC Applications" at ECTC 2026, a leading forum in electronic... -
Researchers Develop UV-Cured Coatings with Reversible Adhesion via Disulfide Bonds, Unlocking New Possibilities for Recyclable Multi-Layer Packaging
European Coatings Germany Overview Researchers have developed innovative UV-cured coatings with reversible adhesion by combining substrate silanization with dynamic disulfide chemistry. This photoinitiator-free system achieves both stron...
