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Virginia Tech Develops Monomaterial Adhesive Tape Outperforming Duct Tape with Chemical Recyclability
Packaging Insights USA Overview Researchers at Virginia Tech have successfully developed a monomaterial pressure-sensitive adhesive tape where both the substrate and adhesive layers are entirely chemically recyclable. This groundbreaking... -
Moldex3D Compression Molding Simulation Achieves Semiconductor Package Defect Prediction and Quality Enhancement
Rheologist gaze & solutions (Moldex3D) Taiwan Overview Moldex3D provides CAE simulation tools for compression molding processes in advanced semiconductor packaging, enabling precise simulation of how encapsulating materials like epoxy mo... -
Master Bond Offers High-Strength, High-Reliability Die Attach Epoxy Adhesives for Microelectronics
Master Bond USA Overview Master Bond provides die attach epoxy adhesives for microelectronic semiconductor packaging and chip-on-board assemblies, featuring high bond strength, thermal cycling resistance, mechanical shock/vibration resis... -
Master Bond Offers Epoxy Underfill Formulations to Boost Reliability for Flip-Chip and CSP Assemblies
Master Bond USA Overview Master Bond provides epoxy underfill formulations designed to significantly enhance the long-term reliability of flip-chip and chip-scale packaging (CSP) assemblies. These materials achieve excellent adhesion to ... -
High-Efficiency Lithium Niobate Electro-Optic Modulator with Barium Titanate Cladding Achieves Low Voltage and Wide Bandwidth
Optica Open USA Overview Researchers have proposed and demonstrated a novel thin-film lithium niobate (TFLN) electro-optic modulator incorporating barium titanate (BaTiO₃) as a cladding material on a quartz substrate. This 10mm-long modu... -
tesa Introduces ‘tesa 4563’ Adhesive Tape for Industrial Roller Wrapping, Combining Excellent Anti-Adhesion and Anti-Slip Properties for Printing and Web Processing Industries
openPR.com / ABNewswire Germany Overview tesa has launched 'tesa 4563,' a new adhesive tape specifically designed for industrial roller wrapping applications. This product features a specially treated fabric substrate and a silicone rubb... -
Nordson Electronics Solutions Unveils ASYMTEK Vantage® XL Fluid Dispensing System for Panel-Level Packaging at SEMICON Taiwan 2026, Boosting Throughput and Yield for AI/HPC Chips
Morningstar / Nordson Electronics Solutions USA Overview Nordson Electronics Solutions launched the new ASYMTEK Vantage® XL fluid dispensing system at SEMICON Taiwan 2026, specifically engineered to meet the stringent demands of panel-le... -
AI Advancements Drive New Semiconductor Packaging Paradigm: Panel-Based Technologies Surpass Traditional Silicon Interposer Limits
Facebook (reposting an industry trend) USA Overview The rapid evolution of AI is pushing semiconductor packaging beyond the practical limits of traditional silicon interposers, driving a new paradigm. Panel-based packaging is emerging as... -
Heterogeneously Integrated Thin-Film Lithium Niobate Coupled-Cavity Modulator Enables Tunable Frequency Beam Splitting on Silicon
arXiv International Overview Researchers have developed a heterogeneously integrated thin-film lithium niobate (TFLN) coupled-cavity modulator on silicon that achieves tunable bidirectional frequency mode conversion. This breakthrough al... -
DELO Introduces DUALBOND LT Series: Next-Gen Ultra-Low Temperature Curing Adhesives for Consumer Electronics, Curing at 45°C
SMT Today Germany Overview DELO has launched a new generation of super low temperature (SLT) curing adhesives, part of its DUALBOND LT family, specifically for consumer electronics assembly. These innovative adhesives achieve reliable bo...
