Substrate– tag –
-
Ajinomoto Fine-Techno’s ABF Breakthrough Powers Next-Gen AI: Enhanced Dielectrics and Reduced CTE Critical for Advanced Packaging
Ajinomoto Fine-Techno Investor Relations Japan Overview Ajinomoto Fine-Techno has announced a significant evolution of its Ajinomoto Build-up Film (ABF) technology, specifically engineered to meet the rigorous packaging demands of next-g... -
Namics Introduces Ultra-Fine-Pitch Underfill to Bolster HBM Reliability for AI and HPC
Namics News & Events Japan Overview Namics has launched a novel capillary underfill material engineered for the extreme fine-pitch flip-chip interconnections vital to High Bandwidth Memory (HBM) stacks. This innovation addresses critical... -
AXT Inc. Announces Indium Phosphide (InP) Backlog Exceeds $100M and Plans to Double Manufacturing Capacity in Both 2026 and 2027
Facebook Taiwan Overview AXT Inc. (AXTI) has announced that its indium phosphide (InP) substrate backlog has surpassed $100 million, with robust long-term order visibility extending beyond 2027. To meet this strong demand, the company re... -
Intel Partners with Lens Technology to Revolutionize Advanced Semiconductor Packaging for AI Era
Storage Newsletter USA Overview Intel has announced a strategic collaboration with Lens Technology, leveraging its expertise in glass materials, high-precision laser processing, and advanced manufacturing. This partnership is designed to... -
3M Launches High-Impact Structural Adhesive for Automotive OEM, Bolstering Weld-Bonded and Rivet-Bonded Joints
DK Hardware USA Overview 3M has introduced its new 3M™ Impact Resistant Structural Adhesive, a two-part epoxy designed for automotive OEM applications to replace or reinforce weld-bonded and rivet-bonded joints. This silver-grey liquid a... -
NVIDIA and Broadcom Dominate 2026 CPO Supply Chain; TSMC’s COUPE Capacity Prioritized for AI Accelerators
SupplyICs USA Overview The 2026 Co-Packaged Optics (CPO) supply chain is facing severe challenges, characterized by a concentrated production landscape where NVIDIA and Broadcom largely control key platforms. A critical bottleneck stems ... -
3D Heterogeneous Integration Shapes AI Server & Data Center Future: Photonic Waveguides Address Power Crisis
YouTube USA Overview This video discusses the future of 3D Heterogeneous Integration (3DHI) in AI server nodes and data centers. As AI data centers proliferate in 2026, creating a power consumption crisis, embedding photonic waveguides i... -
CPO Shipments Intensify as Four Foundries Pursue Diverse Paths in Next-Gen Optical Integration
MLQ News Global Overview As Co-Packaged Optics (CPO) shipments scale up, four major semiconductor foundries—TSMC, Intel, Samsung Foundry, and GlobalFoundries—are pursuing distinct strategies for next-generation optical integration. TSMC ... -
China’s Zhongji Innolight Secures $6.81 Billion in Record Hong Kong IPO Amid Deepening Indium Phosphide Shortage for AI Optics
TrendForce Taiwan Overview Zhongji Innolight, a leading Chinese optical transceiver manufacturer, raised HK$53.41 billion ($6.81 billion) in Hong Kong's largest IPO of 2026, aiming to expand its high-speed optical module business for maj... -
CuspAI Secures $580M to Accelerate AI-Driven Materials Discovery Platform
AlleyWatch UK Overview Cambridge-based startup CuspAI has raised a substantial $580 million from investors including Temasek, Lightspeed Venture Partners, and Samsung Electronics. CuspAI's platform functions as a structured search engine...
