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ASE’s SPIL Nears Arizona Back-End Test Facility Expansion Amidst $10.5B CAPEX Surge; Amkor Boosts US Packaging Investment to $12B
TrendForce Taiwan Overview ASE subsidiary SPIL is finalizing plans for a new back-end test facility in Arizona, part of ASE's $10.5 billion CAPEX for 2026, which includes $4 billion for new facilities and $6.5 billion for equipment. Conc... -
Taiwan’s OSATs Boost AI Capacity with $14.4B Capex; ASE Deepens TSMC CoWoS Collaboration to Meet Soaring Demand
Domino Theory Taiwan Overview Five leading Taiwanese chip packaging and test companies plan a record $14.4 billion (NT$460 billion) in capital expenditures this year to meet surging AI chip demand, matching TSMC's own advanced packaging ... -
JCET Achieves 79.4% YoY Net Profit Growth in H1 2026, Accelerates Advanced Packaging to Meet AI Demand
PR Newswire China Overview JCET Group, a leading global outsourced semiconductor assembly and test (OSAT) provider, reported impressive financial results for the first half of 2026, with net profit attributable to shareholders surging by... -
Amkor Technology Expands U.S. Advanced Packaging Footprint by 67 Acres in Arizona, Bolstering Domestic Manufacturing
Amkor Technology, Inc. USA Overview Amkor Technology has secured an additional 67 acres (approximately 270,000 square meters) adjacent to its existing advanced packaging and test campus in Arizona, significantly expanding its U.S. back-e... -
NXP to Double Malaysia Backend Capacity by Q1 2028; Resonac Reports 46% Growth in AI Backend Materials
note Japan Overview NXP Semiconductors has initiated construction of a new assembly and test (A&T) facility in Malaysia, projected to more than double the site's overall production capacity by Q1 2028 through advanced automation. Con... -
Global Semiconductor Capital Investment to Surge 30% to $240 Billion in 2026, Driven by AI Inference Demand; Advanced Packaging Fuels Multi-Year Double-Digit Growth
Soka Technology Unknown Overview The global semiconductor industry is projected to enter an unprecedented capital investment supercycle in 2026, driven by a skyrocketing demand for AI inference capabilities. Industry forecasts estimate t... -
APC 2026: Advanced Packaging, Interconnects, and Chiplets Propel AI Systems Beyond Traditional Scaling
SEMI Europe Europe Overview The Advanced Packaging Conference (APC) 2026 convened to address the critical role of power delivery and interconnect innovations in driving AI system performance. As traditional device scaling approaches its ... -
TrendForce Reports TSMC Expanding CoWoS Front-End Outsourcing to OSATs Amid Surging NVIDIA ASIC Demand
TrendForce Taiwan Overview TrendForce reports that TSMC is reportedly expanding the outsourcing of key front-end processes for its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging to OSATs (Outsourced Semiconductor Assembly and Test... -
SiC Power Modules Get a Boost: Advanced Packaging with AMB and Embedded Die Transforms EV and AI Data Centers
[Industry Publication/Research] Global Overview Advanced packaging technologies for Silicon Carbide (SiC) power modules are dramatically improving thermal management and power density in electric vehicle (EV) inverters and AI data center... -
Amkor to Invest $7 Billion in Arizona for Advanced AI Chip Packaging, Shifts Korean SiP Production to Vietnam
Seeking Alpha USA Overview Amkor Technology is making a monumental $7 billion investment to construct an advanced packaging and test campus in Arizona, slated for production by early 2028, to address the escalating demand for AI chips. T...
