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Amkor Technology Expands Arizona Campus with 67-Acre Acquisition, Bolstering U.S. Advanced Packaging OSAT Capacity
AllMind AI News USA Overview Amkor Technology has acquired an additional 67 acres in Arizona to significantly expand its U.S. advanced semiconductor packaging and test capacity. This expansion, supported by up to $407 million in CHIPS Ac... -
Amkor Technology Commits $2.5B-$3.0B to Advanced Packaging Facilities for AI Demand, Arizona Plant Slated for 2028 Production
Hudson Labs USA Overview Amkor Technology plans a substantial capital expenditure of $2.5 billion to $3.0 billion for fiscal year 2026, driven by accelerating demand for advanced packaging in AI and data center computing. The investment ... -
ASE Elevates Advanced Packaging Quotes Over 20% Amid Explosive AI Demand Crunch
SiliconAnalysts Taiwan Overview ASE Technology, the world's largest outsourced semiconductor assembly and test (OSAT) provider, has increased its advanced packaging service prices by over 20%. This hike is a direct response to unpreceden... -
OSAT Vendors Report Strong Q1 2026 Revenue Growth Driven by AI-Related Advanced Packaging Demand: ASE Up 18%, Amkor Up 25%
Counterpoint Research Global Overview The Outsourced Semiconductor Assembly and Test (OSAT) sector recorded robust revenue growth in Q1 2026, fueled by surging AI-driven advanced packaging demand. ASE Technology Holding reported an 18% y... -
TSMC and Amkor Technology Forge 10-Year Strategic Partnership to Expand Advanced Chip Packaging Capabilities in the US
Focus Taiwan USA Overview TSMC and Amkor Technology have entered a 10-year strategic agreement to significantly bolster advanced semiconductor packaging and test capacity in the United States. This partnership aims to expand advanced pac... -
ASE Technology Holding Accelerates AI Chip Production with Major Packaging Expansion, Raises 2026 LEAP Revenue Target to Over $3.5 Billion
Crypto Briefing Taiwan Overview ASE Technology Holding is embarking on a significant global expansion, including 15 new facilities, to address the escalating demand for AI chips. This strategic move, leveraging their LEAP platform and VI... -
Malaysia Invests RM185 Million ($40M) in Advanced Semiconductor R&D Initiative, Targeting 7% Global Packaging Market Share with HBM4 Test Chip Development
Malay Mail / Digital News Asia Malaysia Overview Malaysia's Ministry of Science, Technology and Innovation (Mosti) has launched a RM185 million (approx. $40 million USD) Research, Development, Innovation, Commercialization, and Economy (... -
ASE Technology Holding Raises 2026 Capex to $8.5 Billion Driven by Surging AI Advanced Packaging Demand, Launches 15 Expansion Projects in Taiwan & Malaysia
SemiMedia Taiwan Overview ASE Technology Holding, the world's largest OSAT provider, has significantly increased its 2026 capital expenditure plan from $7 billion to $8.5 billion, a 21.4% jump, driven by robust demand from AI servers, HP... -
Nokia Announces Major Expansion of U.S. Advanced Semiconductor Test and Packaging Operations in Pennsylvania, Doubling Workforce to Over 500, to Bolster AI Infrastructure
GlobeNewswire USA Overview Nokia has unveiled a major expansion of its Advanced Test and Packaging (ATP) operations in Allentown, Pennsylvania. This investment aims to enhance domestic production capacity for optical networking technolog... -
Amkor Supercharges U.S. Chip Packaging with 67-Acre Arizona Expansion, Aiming for First High-Volume Advanced OSAT
StocksToTrade USA Overview Amkor Technology has significantly expanded its U.S. presence by acquiring an additional 67 acres at its advanced packaging and test campus in Peoria, Arizona. This strategic move targets establishing the natio...
