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TSMC and Amkor Forge 10-Year Strategic Partnership to Boost U.S. Advanced Packaging Capabilities
Focus Taiwan Taiwan Overview TSMC and Amkor Technology have entered a 10-year strategic agreement to bolster advanced semiconductor packaging in the United States. Under this pact, TSMC will procure advanced packaging and test services f... -
Nokia Ramps Up U.S. Advanced Chip Packaging Capacity Tenfold in Pennsylvania to Fuel AI Networks
Cyprus Shipping News キプロス Overview Nokia is significantly expanding its U.S. advanced semiconductor test and packaging operations in Allentown, Pennsylvania, targeting a tenfold increase in domestic production capacity for optical ne... -
ASE Technology Raises 2026 LEAP Revenue Outlook Above $3.5 Billion, Driven by Soaring AI Advanced Packaging Demand
Zacks USA Overview ASE Technology Holding expressed strong confidence in its Leading Edge Advanced Packaging (LEAP) business trajectory, raising its 2026 LEAP revenue outlook by 10% to over $3.5 billion. This upward revision explicitly r... -
Amkor Bolsters U.S. Semiconductor Ecosystem with Over $7 Billion Investment in Arizona Advanced Packaging Facility
Amkor USA Overview Amkor Technology is dramatically escalating its commitment to a new advanced packaging and test facility in Peoria, Arizona, increasing its investment from an initial $2 billion to over $7 billion. This strategic expan... -
Samsung to Establish Gwangju Advanced Packaging Facility, Eyes Full HBM Hybrid Bonding Transition by 2029
TrendForce South Korea Overview Samsung Electronics is reportedly considering a new advanced semiconductor packaging plant in Gwangju, South Korea, with investment plans potentially announced by June 2026. This strategic facility will fo... -
Singapore Semiconductor Testing Equipment Market Projected to Reach $310 Million by 2033, Growing at 7.8% CAGR
ABNewswire Singapore Overview This article provides an overview of a market research report on the Singapore semiconductor testing equipment market, distributed by ABNewswire. The report forecasts the market to reach $310 million by 2033... -
Samsung Electronics to Invest $1.5 Billion in Vietnam Semiconductor Test Facility Amid Surging AI Chip Demand
Quintile Reports South Korea Overview Samsung Electronics announced plans to invest approximately $1.5 billion in a semiconductor testing facility in Vietnam to address the memory chip shortage caused by surging AI chip demand. This stra... -
Amkor Technology Acquires 67 Additional Acres in Arizona, Expanding U.S. Advanced Packaging Footprint
Dataquest Bureau USA Overview Amkor Technology has secured an additional 67 acres adjacent to its existing campus in Peoria, Arizona, to significantly expand its U.S. advanced semiconductor packaging and test capabilities. This strategic... -
CEA-Leti Demonstrates 1µm Pitch Die-to-Wafer Hybrid Bonding, Addressing AI Hardware Bottlenecks
Chiplet Marketplace France Overview CEA-Leti announced a significant advancement at ECTC 2026, demonstrating functional test vehicles utilizing die-to-wafer (D2W) hybrid bonding down to 1µm pitch, poised to resolve critical AI hardware b... -
Imec and EV Group Set New World Record for 3D Chip Stacking Precision with Sub-40nm Wafer Bond Overlay
PR Newswire ベルギー Overview Imec and EV Group have achieved a world-record post-bond overlay accuracy of less than 40 nanometers across a 300mm wafer for 200nm pitch hybrid bonding, a crucial advancement for next-generation 3D ICs. Dem...
