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ASE Technology Ups 2026 Capex to Record $10.5 Billion, a 23.5% Increase, Driven by Surging AI Packaging Demand
Digitimes Taiwan Overview ASE Technology Holding, the world's largest semiconductor packaging and test provider, increased its 2026 capital expenditure plan by 23.5% to a record $10.5 billion from an initial $8.5 billion, responding to s... -
Malaysia Invests US$45 Million to Propel Advanced Chip Packaging, Targeting HBM4 Domestic Proof-of-Concept
Asia News Network Malaysia Overview Malaysia announced a 185 million ringgit (approx. US$45 million) investment into semiconductor projects to boost its advanced chip packaging capabilities for AI, data centers, and high-performance comp... -
NVIDIA Commits $1.5B Prepayment to Amkor for U.S. AI Chip Advanced Packaging Expansion by 2028
ETElectronics USA Overview NVIDIA is investing $1.5 billion in Amkor Technology through an upfront payment to significantly expand its advanced packaging capacity for AI chips in the U.S. This strategic partnership ensures NVIDIA's acces... -
SK Hynix Reapproves 7.1 Trillion Won Investment for Cheongju P&T7, Significantly Bolstering Advanced Packaging Capacity for HBM and AI Memory
The Elec South Korea Overview SK Hynix has reapproved a 7.1 trillion won (approximately $5.5 billion) investment for its Cheongju P&T7 project, aiming to significantly bolster its advanced packaging capacity for AI memory products, i... -
PM Modi Inaugurates Kaynes Semicon’s ₹33 Billion OSAT Facility in Gujarat, Targeting 2.3 Billion Chips Annually and 5,000 Jobs
YouTube (ANI News) India Overview Indian Prime Minister Narendra Modi announced the inauguration of Kaynes Semicon's OSAT (Outsourced Semiconductor Assembly and Test) facility in Sanand, Gujarat, which commenced commercial production on ... -
India’s Semiconductor Ecosystem Rapidly Expanding: Government Commits ₹1.275 Trillion for Semicon 2.0, First ATMP/OSAT Facility Operational
Asia Briefing India Overview India's semiconductor manufacturing ecosystem is rapidly expanding in 2026, with 13 approved semiconductor projects currently operational or under development, including the launch of the first ATMP/OSAT faci... -
Indian State of Madhya Pradesh Signs MoU for ₹6,200 Crore OSAT Facility with Paras Semiconductors, Advancing Heterogeneous Integration and 3D Packaging
ET Government India Overview The government of Madhya Pradesh, India, announced a Memorandum of Understanding with Paras Semiconductors to establish an advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly and Test) fa... -
China’s HKC Invests 4 Billion RMB in New Advanced Semiconductor Packaging and Test Line in Shaoxing for Heterogeneous Integration
TrendForce China Overview China's HKC announced a 4 billion RMB ($550 million) investment in an advanced semiconductor packaging and test project in Shaoxing Economic Development Zone. A new subsidiary, Zhejiang Huaxin Advanced Semicondu... -
HBM Supply Crunch Deepens: DRAM Wafer Production and Advanced Packaging/Test Emerge as Dual Bottlenecks Amid Samsung, SK Hynix, Micron Rivalry
Industry Analysis International Overview High Bandwidth Memory (HBM), central to AI, faces dual bottlenecks in both DRAM wafer manufacturing and advanced packaging/test capacity. HBM achieves high bandwidth and energy efficiency through ... -
Applied Materials Highlights MES’s Critical Role in Recovering Capacity and Managing Complexity for Advanced Packaging and Test Facilities
Applied SmartFactory Solutions (Applied Materials) USA Overview Applied Materials emphasizes the crucial role of Manufacturing Execution Systems (MES) in advanced packaging and test (ATP) facilities for capacity recovery, loss reduction,...
