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Semiconductor Back-End
Korea Addresses HBM Test Equipment Bottleneck by Fostering Domestic Suppliers
eferix.substack.com South Korea Overview South Korea has identified the HBM test equipment bottleneck, historically dominated by foreign companies like Advantest and Teradyne, as a national supply chain vulnerability. In response, SK Hyn... -
Semiconductor Back-End
Amkor Technology Targets $11B Revenue by 2030, Anchored by $7 Billion Arizona Advanced Packaging Investment
MarketBeat USA Overview Amkor Technology aims to exceed $11 billion in revenue by 2030, driven by a $7 billion, two-phase investment in its Arizona advanced packaging and test campus. High-volume manufacturing is slated to begin in 2028,... -
Semiconductor Back-End
ASE Technology Boosts Advanced Packaging Investment to Record $8.5 Billion Amid Surging AI Demand
digitimes Taiwan Overview ASE Technology Holding, the world's largest chip packaging and test company, has significantly raised its 2026 capital expenditure to a record $8.5 billion, driven by surging demand for AI chips. The company pro... -
Semiconductor Back-End
Amkor Technology Secures CHIPS Act Funding, Expands U.S. Advanced Packaging Footprint in Arizona
Amkor Technology (via Business Wire) USA Overview Amkor Technology is significantly boosting its U.S. advanced packaging and test capabilities by acquiring an additional 67 acres adjacent to its existing 104-acre campus in Peoria, Arizon...