TSMC– tag –
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AT&S Initiates High-Volume AI Substrate Production in Malaysia, Backed by Major Customer Commitments and Projecting Substantial Revenue Growth
boerse-social.com Austria Overview AT&S, a leading Austrian manufacturer of high-end IC substrates, has commenced high-volume production of advanced AI substrates at its new Kulim, Malaysia, facility. This expansion, supported by lon... -
Amkor Technology Commits $2.5B-$3.0B to Advanced Packaging Facilities for AI Demand, Arizona Plant Slated for 2028 Production
Hudson Labs USA Overview Amkor Technology plans a substantial capital expenditure of $2.5 billion to $3.0 billion for fiscal year 2026, driven by accelerating demand for advanced packaging in AI and data center computing. The investment ... -
Nvidia Kicks Off Volume Production of Blackwell AI Accelerators with TSMC’s CoWoS-L, Supply to Remain Tight Through Q4
MetalSemi Asia Taiwan Overview Nvidia has commenced volume production of its next-generation Blackwell AI accelerators at TSMC, leveraging the 4NP process and advanced CoWoS-L packaging. Cloud service provider demand is projected to outs... -
TrendForce Forecasts TSMC PIC Capacity to Soar to 25K Wafers/Month by 2028, with NVIDIA and Broadcom as Early COUPE Customers
TrendForce Taiwan Overview TrendForce projects TSMC's Photonic Integrated Circuit (PIC) wafer production capacity will surge to 25,000 wafers per month by 2028, a critical step for mass production of Co-Packaged Optics (CPO). NVIDIA and ... -
CHIPS Act Successfully Attracts Taiwanese Semiconductor Suppliers to US, Creating New Opportunities in Advanced Packaging and Materials Supply
Fidelity Investments USA Overview The U.S. CHIPS Act's $39 billion manufacturing incentives are successfully drawing Taiwan-based semiconductor manufacturers to the United States, providing concrete economic reasons for establishing new ... -
TSMC’s CoWoS Packaging Equipment Supply Chain Sees Robust Demand Amid AI Surge
DigiTimes Taiwan Overview TSMC's CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging equipment supply chain is experiencing extremely strong demand, driven by the explosive growth of AI chips. Key equipment manufacturers are ramping up... -
Nomura Raises TSMC Target Price, Citing AI Infrastructure Cycle as Key Growth Driver
Futu News Taiwan Overview Nomura has upgraded TSMC's target price, attributing its strong growth to the accelerating AI infrastructure cycle. The surging demand for AI chips has led to TSMC's advanced packaging technologies, particularly... -
BOE Commences Sample Shipments of Glass Substrates for Advanced Chip Packaging to Domestic Customers, Signaling Innovation Boost
36Kr English China Overview Chinese display giant BOE Technology has initiated sample shipments of glass substrates for advanced chip packaging to domestic customers. This move signifies China's technological progress in next-generation ... -
eWeek Reports on Critical AI Chip Bottlenecks: Advanced Packaging Identified as Key Solution
eWeek USA Overview A new eWeek report highlights that AI chip performance is confronting significant bottlenecks, deeming advanced packaging technologies essential for resolution. Critically, the scarcity of high-density integration tech... -
AI Packaging Bottleneck Shifts: CoWoS, Wafer-Scale, and CoWoP Emerge as Key Solutions
EDN USA Overview The packaging bottleneck hindering AI chip performance is being addressed by advanced technologies such as CoWoS, wafer-scale packaging, and CoWoP. These innovations optimize the integration of AI processors and HBM by e...
