TSMC– tag –
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Amkor Technology Expands Arizona Campus with 67-Acre Acquisition, Bolstering U.S. Advanced Packaging OSAT Capacity
AllMind AI News USA Overview Amkor Technology has acquired an additional 67 acres in Arizona to significantly expand its U.S. advanced semiconductor packaging and test capacity. This expansion, supported by up to $407 million in CHIPS Ac... -
Global ABF Substrate Shortage to Persist Through 2028 Due to Soaring AI Demand, Impacting High-End Chip Production
DigiTimes Taiwan Overview The global market for ABF (Ajinomoto Build-up Film) substrates is projected to remain in shortage through 2028, driven by escalating demand for AI hardware. This scarcity directly impacts the production of high-... -
ASE Initiates Largest-Ever Global Expansion to Double CoWoS Capacity to 45,000 Wafers/Month by Late 2027
Industry Blog/Analysis International Overview ASE is undertaking its largest global factory expansion in history, commencing construction of six new packaging and testing plants in 2026. This aggressive ramp aims to increase monthly CoWo... -
ASML to Increase EUV and DUV Capacity by Nearly One-Third Annually to Alleviate AI Chip Supply Chain Concerns
ET Electronics News India Overview ASML, a leading semiconductor equipment supplier, announced an annual production capacity increase of nearly one-third (approximately 33%) for its flagship EUV and DUV tools. This expansion aims to meet... -
TSMC Boosts 2026 Capex to Over $64 Billion, Commits Additional $100 Billion in US for Advanced AI Chip Production Amid Surging Demand
Taipei Times Taiwan Overview TSMC, the world's largest contract chipmaker, increased its projected capital expenditure for this year to over US$64 billion, with an additional US$100 billion investment in the US. This aims to address the ... -
ASML Scales Up to Meet AI Chip Demand Surge, Elevates 2026 Outlook
TheFlghts Europe Overview ASML, the dominant provider of lithography equipment, is significantly expanding its production capacity for advanced AI chips in response to unprecedented global demand. The company has consequently raised its ... -
TSMC Accelerates Backend Ecosystem Reorganization, Reshaping Semiconductor Competitive Landscape as Advanced Packaging Breaks Process Shrinkage Limits
The Economy Taiwan Overview Advanced packaging technology is rapidly emerging as a new competitive domain in the semiconductor industry, gaining importance as traditional process shrinkage approaches its technical limits. Packaging techn... -
Semiconductor Industry Pivots to Heterogeneous Large-Scale Integration (HLSI) as AI Reshapes Chip Design
Next Move Strategy Consulting (via EE Times) USA Overview Driven by surging AI workloads, the semiconductor industry is dramatically shifting beyond traditional System-on-Chip (SoC) paradigms towards Heterogeneous Large-Scale Integration... -
Intel’s EMIB-T Emerges as CoWoS Alternative, New XBM Memory Architecture to Alleviate AI Memory Bottleneck
Tom's Hardware USA Overview Intel's 2.5D packaging technology, EMIB-T, is emerging as a credible alternative to TSMC's CoWoS for large-package AI accelerators, expanding validation for 36/35 µm bump pitch to 4.5x reticle silicon packages... -
TSMC Significantly Expands CoWoS Advanced Packaging Capacity, to Begin Production of 14-Reticle-Size Packages by 2028 for Surging AI Demand
Biya Global Limited Taiwan Overview TSMC is substantially expanding its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging capacity to meet the surging demand for AI chips. The company aims to nearly quadruple CoWoS capacity to 130,00...
