TSMC– tag –
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Samsung Electro-Mechanics and Qualcomm Jointly Develop Organic Bridge Technology for 2.1D AI Semiconductor Packaging
The Elec South Korea Overview Samsung Electro-Mechanics and Qualcomm are collaboratively developing an advanced "organic bridge" technology for 2.1D packaging in AI semiconductors. This innovation utilizes organic materials, akin to PCBs... -
Advanced AI Chips Face Intensified Thermal Management Challenges: TSMC Plans 20-Layer HBM Integration in 14x Reticle CoWoS by 2028, Microchannel Cooling Emerges as Key Technology
36Kr China Overview Thermal management has become a critical challenge in advanced-packaged AI chips, particularly due to thermal coupling issues across chiplets in 2.5D, 3D IC, CoWoS, and HBM architectures. TSMC's roadmap for 2028 inclu... -
ASE’s SPIL Nears Arizona Back-End Test Facility Expansion Amidst $10.5B CAPEX Surge; Amkor Boosts US Packaging Investment to $12B
TrendForce Taiwan Overview ASE subsidiary SPIL is finalizing plans for a new back-end test facility in Arizona, part of ASE's $10.5 billion CAPEX for 2026, which includes $4 billion for new facilities and $6.5 billion for equipment. Conc... -
Google Reportedly Considering CoWoS as Backup for 2027 TPUs Amid Intel EMIB-T Substrate Yield Lag Reports
No source name USA Overview Google's Humufish TPU project, slated for mass production by late 2027, is reportedly considering TSMC's CoWoS as a backup packaging solution, following reports of lagging substrate yields for Intel's EMIB-T t... -
Nvidia Chip Sales Projected to Double Next Year, Accelerating HBM4 Transition Amid TSMC CoWoS Packaging Bottleneck
No source name USA Overview Nvidia CEO Jensen Huang forecasts a doubling of Nvidia chip sales next year and an accelerated transition to HBM4, with TSMC's CoWoS advanced packaging identified as a primary shipping bottleneck. CoWoS is cru... -
HBM Identified as Primary Bottleneck for AI Chip Manufacturing; Nvidia, Google, AMD, Amazon Consumed 90% of Global Supply in 2025
New Market Pitch USA Overview High Bandwidth Memory (HBM) has emerged as the most significant bottleneck in AI chip manufacturing, surpassing advanced packaging technologies like CoWoS. According to Epoch AI estimates, just four companie... -
TSMC to Boost 2nm and 3nm Advanced Process Capacity by up to 22% by Mid-2027 to Meet Soaring AI/HPC Demand
BigGo Finance Taiwan Overview TSMC plans a significant capacity expansion for its 2nm and 3nm advanced processes to meet surging demand for AI and HPC chips. The 2nm monthly capacity is projected to increase by approximately 22% to 110,0... -
TSMC to Double CoWoS Advanced Packaging Capacity to 260,000 Wafers/Month by 2028, Driving OSAT and Intel Orders Amid Supply Crunch
BigGo Finance Taiwan Overview TSMC plans to double its CoWoS advanced packaging capacity from 130,000 wafers/month to 260,000 wafers/month by the end of 2028, primarily driven by surging AI chip demand. This expansion, centered on its AP... -
TSMC Accelerates Co-Packaged Optics (CPO) Deployment, Eyes ‘CPO Moore’s Law’ for AI Chip Performance Boost
KuCoin Taiwan Overview As GPU and ASIC computing power continues to advance, TSMC is accelerating the deployment of Co-Packaged Optics (CPO) to address the power consumption and signal transmission limits of traditional copper interconne... -
Meta to Deploy Custom MTIA 450 & 500 AI Chips by 2027, Challenging Nvidia’s Data Center Dominance
BigGo Finance USA Overview Meta Platforms announced plans to deploy its third-generation MTIA 450 (Arke) custom AI chips by early 2027, followed by the fourth-generation MTIA 500 (Astrid) by year-end, targeting general-purpose inference ...
