TSMC– tag –
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Apple Unveils 2nm iPhone 18; Samsung Cuts Thermal Resistance by 16% with Encapsulant and TIM Innovations, Intensifying Competition with TSMC
BigGo Finance South Korea Overview Following Apple's announcement of the 2nm iPhone 18, Samsung Electronics and TSMC are intensifying their competition in next-generation semiconductor packaging and thermal management. Samsung has achiev... -
Korea and Taiwan Surge as Semiconductor Equipment Investment Hubs, Driven by HBM and Advanced Packaging in H1 2026
The Information Network USA, South Korea, Taiwan Overview In the first half of 2026, global semiconductor equipment sales witnessed a significant geographical pivot, with South Korea (up 32.4%) and Taiwan (up 24.0%) emerging as primary g... -
Scientech Sees 50% Surge in Advanced Packaging Equipment Shipments Driven by AI Demand; TSMC’s CoPoS Production Set for 2027 Launch
Taipei Times Taiwan Overview Scientech Corp, a supplier of advanced packaging equipment and reclaimed wafers, anticipates a 50% year-on-year increase in shipments for 2026, fueled by robust AI application demand and rapid technological s... -
NVIDIA to Boost CoWoS Production Capacity by 3.5x to Over 120,000 Wafers/Month by End-2026, Securing HBM4 Supply
SemiconductorX USA Overview NVIDIA plans to scale its CoWoS (Chip-on-Wafer-on-Substrate) production capacity by 3.5x to 120,000–130,000 wafers per month by the end of 2026, up from 35,000, driven largely by its own demand. The company is... -
Taiwan Accelerates Mass Production of Silicon Photonics for AI Infrastructure; TSMC and ASE Lead CPO Mainstreaming Efforts
Taiwan News Taiwan Overview Taiwan is accelerating the mass production of silicon photonics technology to meet the demands of AI infrastructure. Led by TSMC and ASE Technology Holding, this initiative aims to mainstream Co-Packaged Optic... -
Taiwan Launches Silicon Photonics Alliance Led by TSMC to Resolve AI Data Transmission Bottlenecks with 30-50% Power Reduction
CHOSUNBIZ South Korea Overview Taiwan's government and leading semiconductor firms, including TSMC, have established a 'Silicon Photonics Alliance' to build a next-generation data transmission ecosystem for the AI era. This initiative ai... -
Imec Unlocks 22nm Pitch Single Patterning for High NA EUV Lithography, Accelerating Next-Gen Microchip Manufacturing
imec Belgium Overview Imec has announced a significant advancement in high-NA extreme ultraviolet (EUV) lithography, extending chemically amplified resists to enable single patterning of 22nm pitch line structures. This breakthrough is c... -
TSMC’s CoWoS Drives AI Semiconductor Demand, Japanese Material Suppliers Expand Ecosystem in Taiwan
The Economy Taiwan Overview TSMC's CoWoS advanced packaging technology is a primary driver for demand in AI accelerators and HBM, leading Japanese material suppliers like Namics (underfill) and Fujifilm (CMP slurry) to expand operations ... -
Tom’s Hardware Reports: TSMC Achieves 6-Micron Hybrid Bonding, Full HBM Integration Potentially Delayed to HBM4E/HBM5 (2027-Late 2020s)
Tom's Hardware USA Overview Tom's Hardware reports on the 2026 status of hybrid bonding, revealing TSMC's SoIC achieves 3.5D integration by combining hybrid-bonded stacks with CoWoS modules on silicon interposers, reaching 6-micron preci... -
MDPI Review Compares Advanced Semiconductor Packaging: Spotlighting Thermal Management and Reliability Challenges
MDPI Switzerland Overview A review paper published in MDPI critically compares advanced packaging architectures, including 2D, 2.5D, and 3D integration, detailing challenges in thermal management, warpage from thermomechanical mismatch, ...
