TSMC– tag –
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AI Supply Chain Maxed Out: 40-Week Lead Times Become New Normal as HBM Emerges as Primary Bottleneck Over TSMC CoWoS
Markets Insider USA Overview The AI supply chain faces severe constraints, with 40-week lead times becoming the new norm. High Bandwidth Memory (HBM) has replaced TSMC's CoWoS advanced packaging as the primary bottleneck, driven by NVIDI... -
Scientech Forecasts 50% Shipment Growth Driven by AI Demand, Targets Next-Gen CoPoS Market Entry
Taipei Times Taiwan Overview Scientech, a Taiwanese supplier of advanced packaging equipment and reclaimed wafers, anticipates a 50% year-over-year increase in shipments this year, fueled by robust AI application demand and rapid technol... -
TSMC Establishes Kaohsiung Advanced Packaging Cluster, Aims for Up to 50% Efficiency Gains
digitimes Taiwan Overview TSMC announced the establishment of an advanced packaging materials and equipment supply chain cluster in Kaohsiung's Baipu Industrial Park, Taiwan. This strategic move aims to enhance efficiency in advanced pac... -
Taiwan’s OSATs Boost AI Capacity with $14.4B Capex; ASE Deepens TSMC CoWoS Collaboration to Meet Soaring Demand
Domino Theory Taiwan Overview Five leading Taiwanese chip packaging and test companies plan a record $14.4 billion (NT$460 billion) in capital expenditures this year to meet surging AI chip demand, matching TSMC's own advanced packaging ... -
TSMC CoWoS Capacity Expands 9X in 3 Years, Yet 10% AI Chip Shortage Persists with NVIDIA Securing 60%
XenoSpectrum Taiwan Overview TSMC's CoWoS advanced packaging capacity has surged nine-fold over three years, but a 10% supply shortage for AI chips remains due to soaring demand. NVIDIA currently secures approximately 60% of TSMC's CoWoS... -
Lumentum Secures Multi-Billion Dollar 1.6T Optical Module Deal with NVIDIA, Coherent Achieves Record Revenue; AI Data Center Optics Investment Accelerates, TSMC to Mass Produce 1.6nm Process
Troy Technical (note.com) Global Overview A weekly report to August 28, 2026, reveals accelerating investment in optical communications driven by AI data center demand. Lumentum secured a multi-billion dollar long-term contract with NVID... -
Semiconductor Engineering Analyzes: Photonics Forces Chiplet Rethink, Multi-Physics Co-Design to Solve Thermal, Stress, Alignment Challenges
Semiconductor Engineering USA Overview Semiconductor Engineering reports that the integration of photonics is fundamentally forcing a reevaluation of chiplet design. Due to the bidirectional interaction of thermal, mechanical, electromag... -
SEMICON Taiwan Focuses on Silicon Photonics and Co-Packaged Optics (CPO) for AI Infrastructure; Foxconn to Ship CPO Switches in Q3
CNA Taiwan Overview SEMICON Taiwan 2026 announced its primary focus on silicon photonics and Co-Packaged Optics (CPO) technologies to meet the explosive demand from AI infrastructure. Key highlights include advancements in TSMC's Compact... -
BigGo Finance Report: AI Compute Interconnect at Inflection Point, NPO and CPO Reshaping Industry Value Chain
BigGo Finance USA Overview According to a BigGo Finance report, AI compute interconnects are at a critical inflection point, with Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) fundamentally reshaping the industry value chain. C... -
Marvell Predicts Co-Packaged Optics (CPO) Scale-Up from Late 2027, Emphasizing Taiwan and TSMC’s Central Role
digitimes Taiwan Overview Marvell's Senior Vice President and CTO, Radha Nagarajan, announced at SEMICON Taiwan 2026 that the significant commercial scale-up of Co-Packaged Optics (CPO) is anticipated to begin in late 2027. He emphasized...
