TSMC– tag –
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TSMC Reportedly Manufactures World’s First Commercial Photonic Processor, Claiming 1000x Speed and 100x Energy Efficiency Improvement
Facebook Taiwan Overview Reports from a Taiwanese Facebook post indicate that TSMC has successfully manufactured the world's first commercial photonic processor. This innovative processor, which uses light instead of electricity for comp... -
Sony and TSMC Forge Joint Venture to Propel Next-Generation Image Sensor Innovation
Design And Reuse Japan・Taiwan Overview Sony Semiconductor Solutions and Taiwan Semiconductor Manufacturing Company (TSMC) have established a joint venture aimed at advancing next-generation image sensor development and manufacturing. Th... -
NVIDIA’s Spectrum-X CPO Ethernet Switches Enter Mass Production, Delivering 5x Power Efficiency and AI Uptime
BigGo Finance Taiwan Overview NVIDIA's Spectrum-X Ethernet silicon photonics switches, leveraging Co-Packaged Optics (CPO) technology, have entered full mass production. This 'world's first production 200G/lane CPO Ethernet switch system... -
AI Chip Race Shifts to Advanced Packaging as 130M Accelerators Ship; TSMC’s CoWoS Dominates, Intel Pursues Alternatives
The Korea Economic Daily South Korea Overview The competitive landscape in the AI semiconductor market is shifting from process nodes to advanced packaging, with over 130 million AI accelerators projected to ship with advanced-packaged o... -
TSMC Declares AI Advanced Packaging Competition Shifts to System-Level Reliability and Validation, Highlighting 3DIC Importance at OCP APAC 2026
digitimes Taiwan Overview At the OCP APAC 2026 summit, TSMC Vice President of Advanced Packaging Technology & Service, Jun He, announced that the escalating AI computing demand is rapidly increasing chip integration complexity, shift... -
Global Semiconductor Sales Soar 2.2x to Record $134.5 Billion in June 2026; TSMC Achieves Over 99% CoWoS Yield But Flags HBM and ABF Substrate Bottlenecks
Amiko Consulting Japan Overview Global semiconductor sales reached an unprecedented monthly high of $134.5 billion in June 2026, marking a 2.2-fold increase year-over-year, driven by a dramatic surge in AI data center investments across ... -
HBM Supply Crunch: Long Backlogs for Bonding Equipment and Low Yields Create Bottleneck, Constraining AI Demand Until 2027
AI CERTs News USA Overview HBM stack manufacturing demands Through Silicon Vias (TSV) and high-precision bonding equipment, with low yield tolerance posing an industry challenge. Limited vendors for these specialized tools mean HANMI, a ... -
HBM Supply Crisis of 2026 Projected to Persist Until 2027, Redefining AI Hardware Deployment Bottleneck
EnkiAI USA Overview Explosive growth in the AI sector has triggered a structural HBM supply crisis, making it the primary bottleneck for AI hardware deployment throughout 2026, projected to last until at least 2027. The market has shifte... -
TSMC Achieves 98-99% Yield for AI Products on CoWoS 5.5x Process, Targets 14x Reticle Size Expansion by 2029
Wccftech Taiwan Overview TSMC Vice President Ho Chun announced remarkable 98% to 99% yields for multiple AI-related products assembled using the CoWoS 5.5x process. This exceptional achievement highlights TSMC's manufacturing prowess in ... -
TSMC Doubles Advanced Packaging Capacity Over Three Years; Samsung Expands 2nm & Advanced Packaging Collaboration with Broadcom
BigGo Finance Taiwan Overview TSMC revealed it has doubled its advanced packaging capacity annually for the past three years but still lags behind surging AI chip demand, operating 10 dedicated facilities globally. Meanwhile, Samsung Ele...
