TSMC– tag –
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TSMC to Begin Chip-Level Co-Packaged Optics (CPO) Production in H2 2026, Foreseeing Silicon Photonics Dominance in AI
Taipei Times Taiwan Overview TSMC Vice President K.C. Hsu announced at SEMICON that silicon photonics will gain dominance by next year, driven by AI demand, enabling chip-level Co-Packaged Optics (CPO) packaging. TSMC is on track to begi... -
TSMC Predicts Silicon Photonics to Dominar Over Half of Optical Transceiver Market by 2027, Driven by Exploding AI Infrastructure Demand
IN Electronics & Design Taiwan Overview TSMC forecasts that silicon photonics will account for over 50% of the optical transceiver market by 2027, propelled by the accelerated adoption of optical links in AI infrastructure. Their CO-UPE ... -
SK hynix’s MR-MUF and Samsung’s TC-NCF Revolutionize Thermal Management in AI Semiconductor HBM: Driving Advanced Packaging Evolution
USD Analytics Global Overview The evolution of AI is driving significant changes in semiconductor packaging and High Bandwidth Memory (HBM) technologies, with SK hynix's Advanced MR-MUF and Samsung's TC-NCF technologies solving critical ... -
Google’s Next-Gen TPUs Adopt Intel EMIB Packaging, Achieve Yield Targets in First Mass Production
digitimes Taiwan Overview Google has successfully implemented Intel's Embedded Multi-die Interconnect Bridge (EMIB) packaging technology for mass production of its next-generation TPUs, already achieving yield targets. This strategic mov... -
TSMC Completes 1.6nm A16 Process Development, Targets Q4 Mass Production for Next-Gen AI/HPC Chips
Design And Reuse Taiwan Overview TSMC has successfully completed development of its 1.6nm A16 process technology, with mass production scheduled for Q4. This cutting-edge process is foundational for next-generation high-performance compu... -
TSMC CoWoS and ABF Substrate Supply Bottlenecks Threaten AI Chip Production Amid $265B Market Opportunity
Silicon To Software USA Overview For leading AI accelerators, wafer manufacturing capacity is not the only constraint; CoWoS advanced packaging and ABF (Ajinomoto Build-up Film) substrate qualification cycles are also limiting production... -
Amkor Technology Expands U.S. Advanced Packaging Footprint by 67 Acres in Arizona, Bolstering Domestic Manufacturing
Amkor Technology, Inc. USA Overview Amkor Technology has secured an additional 67 acres (approximately 270,000 square meters) adjacent to its existing advanced packaging and test campus in Arizona, significantly expanding its U.S. back-e... -
China Invests 40 Billion Yuan ($5.5 Billion) in New Advanced Packaging Projects for AI/HPC to Prepare for Next Chip Shortage
All-About-Industries China Overview China's advanced packaging industry is embarking on a new wave of capacity expansion to meet the escalating demand for AI and High-Performance Computing (HPC) chips. Between May and July 2026, approxim... -
HBM4 Breaks Bottlenecks: Hybrid Bonding Delivers 20%+ Thermal Reduction, 40% Power Efficiency Boost, 2.0TB/s+ Bandwidth
SemiHub.io International Overview HBM4, the next-generation High Bandwidth Memory, is set to significantly advance AI/HPC performance by doubling its I/O width to 2048 bits, targeting over 2.0 TB/s bandwidth per stack and substantial pow... -
SK Hynix Secures HBM4 Future: 70% Price Surge, 2026 Capacity Sold Out, and $3.87B US Investment for Advanced Packaging Independence
Adalytica and others South Korea Overview SK Hynix has signaled its dominance in the High Bandwidth Memory (HBM) market by reportedly increasing HBM4 prices by 70% for its 2026 supply, which is already entirely presold. Concurrent with t...
