TSMC– tag –
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YieldWerx Analyzes 2026 Photonics & Optical I/O Trends: In-Package Optical I/O Becomes Essential for AI Workloads
yieldWerx USA Overview YieldWerx has released an analysis of key trends and challenges in photonics and optical I/O for 2026, highlighting that optical interconnects are undergoing a dramatic shift from system-to-system to in-package com... -
Lightmatter’s Photonic Processor Achieves ~10x AI Workload Speedup and 3.5-5x Power Efficiency Over GPUs
Daily Maverick USA Overview Lightmatter's photonic processor has demonstrated the ability to execute AI workloads approximately 10 times faster than traditional GPUs, while also improving power efficiency by 3.5 to 5 times. This achievem... -
Tower Semiconductor Invests $3 Billion in Japan with METI Support, Reviving Fab for 300mm Silicon Photonics Manufacturing
Tom's Hardware Japan Overview Tower Semiconductor has announced a $3 billion investment, backed by Japan's Ministry of Economy, Trade and Industry (METI), to expand its semiconductor operations in Japan, focusing on 300mm silicon photoni... -
IMEC, TSMC, Intel, and Samsung Pursue Atomically-Thin 2D Transistors to Sustain Moore’s Law Beyond Silicon in 2026
Internet Pros USA Overview As silicon transistors approach scaling limits, industry leaders IMEC, TSMC, Intel, and Samsung are shifting to atomically-thin 2D semiconductors for next-generation chips. Materials like molybdenum disulfide (... -
TSMC Achieves Record $22 Billion Q2 Profit with 77% Surge on AI Chip Demand, Commits $100 Billion Additional Investment in Arizona, and Expands CoWoS Capacity by Over 50%
ServeTheHome Taiwan Overview TSMC, the world's largest contract chipmaker, reported a record net profit of $22 billion in Q2 2026, marking a 77% year-over-year increase, driven by booming AI chip demand. The company raised its full-year ... -
AI Fuels “Golden Age” of Advanced Packaging: Amkor-TSMC 10-Year CoWoS Deal Strengthens U.S. Supply Chain, ASE Builds 6 New Fabs Globally
TechNews Taiwan Overview 2026 marks the "golden age" of advanced packaging, with AI-driven demand prompting massive investment expansions from global packaging and test manufacturers. Amkor secured a 10-year long-term cooperation agreeme... -
TSMC Commits Additional $100 Billion to U.S. Semiconductor Manufacturing and Packaging, Bringing Total Investment to $265 Billion for 12 Facilities
NIST - National Institute of Standards and Technology USA Overview TSMC has announced an additional $100 billion investment in advanced semiconductor manufacturing and packaging facilities in the U.S., as part of a historic trade and inv... -
Applied Materials Fortifies AI Advanced Packaging with 10-Year TSMC Pact and NEXX Acquisition
Simply Wall St News USA Overview Applied Materials significantly expanded its presence in AI advanced packaging by securing a 10-year strategic partnership with TSMC for AI-focused packaging and completing the acquisition of NEXX. These ... -
Taiwan’s TGV Glass Substrate Supply Chain Advances: E&R Engineering Ships Laser Modification Equipment to US Client, Accelerating Mass Production
Taiwan News Taiwan Overview Driven by escalating HPC demand, glass substrates are emerging as a next-generation advanced packaging solution, leading to the formation of a robust Through-Glass Via (TGV) supply chain in Taiwan. E&R Eng... -
CoWoS Identified as Core Bottleneck for AI GPU Shipments, Distinct from HBM Shortage
BiyaPay Blog International Overview CoWoS (Chip-on-Wafer-on-Substrate) is an advanced packaging technology integrating GPUs, HBM, and chiplets; its limited capacity forms a critical manufacturing integration bottleneck for AI GPU shipmen...
