TSMC– tag –
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SEMICON West Relocates to Phoenix, Arizona, Bolstering U.S. Semiconductor Hub with TSMC’s $100 Billion Advanced Fab Plans
Arizona Commerce Authority USA Overview SEMI announced the permanent relocation of SEMICON West to Phoenix, Arizona, adopting an annual spring schedule from March 30 – April 1, 2027. This move reflects Arizona's rapid expansion as a semi... -
ASE Technology Ups 2026 Capex to Record $10.5 Billion, a 23.5% Increase, Driven by Surging AI Packaging Demand
Digitimes Taiwan Overview ASE Technology Holding, the world's largest semiconductor packaging and test provider, increased its 2026 capital expenditure plan by 23.5% to a record $10.5 billion from an initial $8.5 billion, responding to s... -
Intel’s EMIB Dominates AI Packaging with Google Adoption, Prompting TSMC to Develop Similar Tech Amidst CoWoS Constraints
Benzinga USA Overview Intel's EMIB technology is establishing a significant competitive advantage in advanced chip packaging for AI workloads, exemplified by Google's adoption of EMIB-T in its 9th-generation TPUs. Facing CoWoS capacity f... -
NVIDIA and Broadcom Commence Mass Production of Co-Packaged Optics (CPO) Switches: Poised to Cut Data Center Power Consumption by Up to 3.5x
Electronics360 USA Overview NVIDIA and Broadcom have initiated mass production of Co-Packaged Optics (CPO) switches, designed to significantly reduce data center power consumption and latency. NVIDIA's Spectrum-X CPO switch, co-developed... -
Leading Foundries Accelerate Silicon Photonics Mass Production for AI/HPC Demand: UMC Ships First 12-inch Wafers, TSMC’s COUPE Enters Production
TrendForce Taiwan Overview Major foundries including TSMC, UMC, GlobalFoundries, and Tower Semiconductor are accelerating their silicon photonics efforts to meet the growing demand for data transmission bandwidth driven by increasing AI ... -
GlobalFoundries Secures $300M U.S. Department of Commerce Award to Accelerate Silicon Photonics R&D, Bolstering U.S. Leadership
GlobalFoundries USA Overview GlobalFoundries has signed a Letter of Intent with the U.S. Department of Commerce for a $300 million award from the CHIPS R&D Office. This funding aims to accelerate next-generation silicon photonics R&a... -
Lightmatter Joins NVIDIA NVLink Fusion Ecosystem, Accelerates Photonic Interconnect Strategy for AI Data Centers with $850M Funding at $4.4B Valuation
International Banker USA Overview AI hardware and silicon photonics startup Lightmatter has joined NVIDIA's NVLink Fusion ecosystem, accelerating the deployment of high-performance optical interconnects for AI infrastructure. The company... -
TSMC and Kinsus Jointly Developing New AI Chip Packaging Technology Akin to Intel’s EMIB to Address CoWoS Capacity Constraints
Tech in Asia Singapore Overview TSMC is reportedly collaborating with Kinsus to develop a novel AI chip packaging technology, resembling Intel's Embedded Multi-die Interconnect Bridge (EMIB), to alleviate the tight supply of CoWoS capaci... -
NVIDIA Commits $1.5B Prepayment to Amkor for U.S. AI Chip Advanced Packaging Expansion by 2028
ETElectronics USA Overview NVIDIA is investing $1.5 billion in Amkor Technology through an upfront payment to significantly expand its advanced packaging capacity for AI chips in the U.S. This strategic partnership ensures NVIDIA's acces... -
AMD’s Helios AI Rack Challenges NVIDIA with HBM4 Memory Edge, Securing Microsoft as Customer; 2nm Process CPU Also Noted
TrendForce Taiwan Overview AMD's 'Helios AI Rack' is challenging NVIDIA's dominance in the AI market with its HBM4 memory advantage, securing Microsoft as a new key customer. The Helios rack is optimized for AI model training and inferen...
