Underfill– tag –
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Henkel Unveils High-Performance Underfill Material for Advanced Logic and Memory Packaging, Boosting Production Efficiency
Advanced Packaging Journal Germany Overview Henkel has introduced a new high-performance underfill material designed for advanced logic and memory packaging technologies like flip-chip and chiplets. This material significantly improves d... -
Zhengzhou Kerton Chemical Highlights Broad Applications of Epoxy Adhesives for High Performance and Reliability Across Industries
Zhengzhou Kerton Chemical Co., Ltd China Overview Zhengzhou Kerton Chemical Co., Ltd. emphasized the critical role of epoxy adhesives across diverse sectors including automotive, aerospace, electronics, construction, and new energy. For ... -
Hoenle Adhesives Launches High-Reliability Underfill ‘Structalit® 8205’ for Miniaturized, High-Density Electronic Assemblies
Adhesives & Sealants Industry (ASI) Germany Overview Hoenle Adhesives has introduced Structalit® 8205, an underfill designed for modern, miniaturized, and high-density electronic assemblies, offering exceptional mechanical stability, the... -
Henkel Delivers Advanced Semiconductor Packaging Materials to Tackle Thermal and Mechanical Challenges in 2.5D/3D Packaging
Henkel Adhesives Germany Overview Henkel offers a diverse portfolio of advanced semiconductor packaging solutions, including lid and stiffener adhesives, EMI shielding, liquid compression molding solutions, and underfills. These material... -
HBM4E Set to Dominate High-Performance Memory Market by Late 2026-2027 with Up to 4.0 TB/s Single-Stack Bandwidth and 48GB+ Capacity, Accelerating AI Models
Ersa Electronics Global Overview HBM4E is projected to lead the high-performance memory market from late 2026 to 2027, offering a single-stack bandwidth of up to 3.6–4.0 TB/s and capacities exceeding 48GB, significantly boosting ultra-la... -
SK hynix Ships 12-Layer HBM4E Samples with Advanced MR-MUF Packaging, Achieving Over 20% Power Efficiency and 17% Thermal Resistance Improvement Over HBM4
Advanced Packaging News South Korea Overview SK hynix announced the sampling of its 12-layer HBM4E memory for next-generation AI systems, leveraging proprietary Advanced MR-MUF packaging. This innovation delivers 48GB capacity per stack ... -
Imec Targets Optical Interconnect Packaging Bottlenecks for Next-Gen AI and HPC
ApplyKite (imec) ベルギー Overview Imec is seeking a PhD candidate for groundbreaking research into microfluidics and photonics packaging, crucial for optical interconnects in future AI and High-Performance Computing (HPC) systems. The p... -
SK hynix Begins Shipping Next-Gen HBM4E AI Memory Chips with 12-Layer Stack, 48GB Capacity, 16Gbps per Pin, and Over 20% Power Efficiency Boost
Bisinfotech South Korea Overview SK hynix has commenced shipments of its next-generation HBM4E AI memory chips, featuring a 12-layer stack with 48GB capacity, ultra-fast data transfer rates of up to 16Gbps per pin, and over 20% improved ... -
SK Hynix Begins Shipping 12-Layer Next-Gen ‘HBM4E’ Samples for AI, Delivering Significant Performance and Power Efficiency Gains Amidst NVIDIA CEO’s Endorsement
SK hynix Inc. South Korea Overview SK Hynix has commenced shipping samples of its 12-layer 'HBM4E,' a next-generation DRAM for AI, to key customers. This HBM4E features data processing speeds of up to 16Gbps per pin and over 20% improved... -
Henkel Expands Electronics Materials Investment in Korea, Bolstering HBM Packaging Material Development for Surging AI Semiconductor Demand
The Elec Inc. South Korea Overview German materials giant Henkel is expanding its investment in the electronics materials business in South Korea to meet the escalating demand for AI semiconductors. This includes reinforcing R&D pers...
