Underfill– tag –
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YINCAE Unveils UF 88UV Optical Underfill with Near 100% Transparency for Advanced Semiconductor Packaging, Enhancing Inspectability
openPR.com / YINCAE Advanced Materials, LLC USA Overview YINCAE Advanced Materials has launched UF 88UV, an innovative high-transparency optical underfill tailored for advanced semiconductor and optoelectronic packaging, boasting approxi... -
Namics Introduces Ultra-Fine-Pitch Underfill to Bolster HBM Reliability for AI and HPC
Namics News & Events Japan Overview Namics has launched a novel capillary underfill material engineered for the extreme fine-pitch flip-chip interconnections vital to High Bandwidth Memory (HBM) stacks. This innovation addresses critical... -
Haktak Enhances Semiconductor Packaging Solutions for EV Batteries, Power Electronics, and AI Servers
Haktak Global Overview Haktak is reinforcing its comprehensive range of semiconductor and electronics assembly materials, crucial for the reliability of high-performance devices like EV batteries, power electronics, and AI servers. The c... -
Henkel Expands Silicon Valley Application Center to Larger Site, Boosting AI & HPC Material Development in Santa Clara, CA
Henkel USA Overview Henkel has announced the expansion and relocation of its Silicon Valley Application Center for Electronics in Santa Clara, CA, to enhance customer collaboration and accelerate new product development. The upgraded fac... -
Dymax Launches 9310 Dual-Cure Adhesive for High-Reliability PCB Reinforcement, Streamlining Underfill Alternatives for Advanced Electronics and AI Hardware
PR Newswire USA Overview Dymax has launched its 9310 adhesive, an innovative light and secondary heat-cure solution engineered for reinforcing fine-pitch, leadless components on printed circuit boards in advanced electronics and AI hardw... -
Exponential Relationship Between Underfill Adhesive Curing and Shear Strength Unveiled for Flip-Chip Micro-interconnections
springerprofessional.de Germany Overview A new study systematically investigated epoxy-based underfill adhesives in flip-chip packaging, establishing an exponential relationship between the degree of curing and shear strength. Researcher... -
Chiplet Underfill Dispensing Market to Grow Through 2036 Driven by HBM and C2W Hybrid Bonding Void Reduction Needs
Fact.MR USA Overview This article summarizes a market research report from Fact.MR. The chiplet underfill dispensing market is growing, driven by the need for wafer-level underfill in HBM manufacturing and tailored viscosity/cure profile... -
Intel Seeks Senior Module Test Engineer in Kulim, Malaysia to Advance CUF Module Improvement and New Material Application for Advanced Packaging
Jooble USA Overview Intel is recruiting a Senior Module Test Engineer in Kulim, Malaysia, to lead the design and development of advanced manufacturing test processes. This role supports post-packaging burn-in, final test, and system test... -
AtlasPCB Releases BGA Underfill Selection Guide Comparing Capillary Flow and Reworkable Formulations for Automotive, Aerospace
AtlasPCB Unknown Overview AtlasPCB has published a BGA (Ball Grid Array) underfill selection guide as part of its PCB engineering insights blog series. The article comprehensively compares capillary flow, molded underfills, and reworkabl... -
AI Chip Packaging Bottleneck Intensifies: NVIDIA Explores Intel EMIB Amid TSMC CoWoS Shortage, Amkor Commits $7B to Arizona
The Economy Japan Overview The burgeoning AI chip market faces a critical bottleneck in advanced packaging, particularly with TSMC's CoWoS technology, prompting NVIDIA to reportedly consider Intel's EMIB for future GPU production. This s...
