Chip Stacking– tag –
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Taiwan’s MOEA Unveils 29 Cutting-Edge Semiconductor Innovations, Including Double-Sided RDL Process for CoPoS Packaging at SEMICON Taiwan 2026
Ministry of Economic Affairs (MOEA) Taiwan Overview Taiwan's Ministry of Economic Affairs (MOEA) showcased 29 cutting-edge technology innovations at SEMICON Taiwan 2026, encompassing advanced packaging, AI data center power management, a... -
Japan Introduces New Subsidy Program for Advanced Packaging R&D, Focusing on Heterogeneous Integration and 3D Stacking to Enhance Competitiveness
METI Press Release Japan Overview Japan's Ministry of Economy, Trade and Industry (METI) unveiled a new subsidy program to support R&D and mass production investment in advanced packaging technologies for strengthening the domestic s... -
Rapidus Targets 600mm Panel-Level Packaging and 8-Reticle Interposers by 2030 for Advanced AI/HPC Systems
TrendForce Japan Overview Rapidus announced an accelerated advanced packaging roadmap aiming for 600mm panel-level packaging and 8-reticle interposers by 2030. The company has fully activated its Rapidus Chiplet Solutions (RCS) pilot lin... -
Semiconductor Inspection Equipment Market to Reach $13.4 Billion by 2034, KLA Leads in Advanced Packaging Process Control
Exponential Industry USA Overview The semiconductor inspection equipment market is projected to grow at a 7.9% CAGR from 2026 to 2034, reaching $13.4 billion, driven by increasing AI chip complexity and advanced packaging adoption. KLA i... -
NVIDIA Accelerates Feynman AI Platform; TSMC Ramps SoIC Capacity to 50K Wafers/Month by 2027
Benzinga Taiwan Overview NVIDIA is expediting the roadmap for its next-generation Feynman AI platform, prompting TSMC to significantly boost its advanced packaging capabilities. TSMC is rapidly expanding its SoIC technology production, a... -
Besi Semiconductor Reports Doubled Quarterly Orders Driven by Soaring AI and Hybrid Bonding Demand, Expanding Customer Base
WHTC (Reuters) Netherlands Overview BE Semiconductor Industries (Besi) announced a more than twofold increase in quarterly orders year-over-year, driven by robust demand from AI, hybrid bonding, photonics, and data centers. The company's... -
CXMT Confronts HBM Production Barriers: China’s Memory Ambitions Hinge on Yield and Advanced Packaging Breakthroughs by 2028
South China Morning Post China Overview Chinese DRAM manufacturer CXMT continues to grapple with significant technical challenges in establishing stable commercial production of High Bandwidth Memory (HBM), according to SemiAnalysis. Whi... -
Applied Materials Unleashes Six New Systems to Turbocharge AI Chips with Advanced Packaging and Sub-10nm Defect Detection
Applied Materials USA Overview Applied Materials has launched six innovative systems to significantly accelerate the development and manufacturing of DRAM and advanced packaging for next-generation AI chips. These solutions tackle critic... -
BOE Commences Sample Shipments of Glass Substrates for Advanced Chip Packaging to Domestic Customers, Signaling Innovation Boost
36Kr English China Overview Chinese display giant BOE Technology has initiated sample shipments of glass substrates for advanced chip packaging to domestic customers. This move signifies China's technological progress in next-generation ... -
EU Chips Act Allocates €210M to Bolster 3D IC Packaging R&D for Strategic Semiconductor Autonomy
The Chosun Daily EU Overview The European Union has committed €210 million under its EU Chips Act to accelerate research and development in next-generation 3D IC packaging technologies. This significant investment aims to enhance Europe'...
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