Glass Substrate– tag –
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Glass Substrates & TGV Technology Set to Reshape 2027 Advanced Packaging Race; US, Japan, Korea, Taiwan, China Accelerate Development
digitimes Taiwan Overview As AI chip package sizes expand, glass substrates and Through-Glass Via (TGV) technology are emerging as new focal points in advanced packaging competition. Supply chain leaders in the US, Japan, South Korea, Ta... -
Samsung Electro-Mechanics Unveils Next-Gen Package Substrate Technologies for AI & Servers at KPCA Show 2026, Highlighting Warp Reduction & High-Density Interconnects
Samsung Electro-Mechanics South Korea Overview Samsung Electro-Mechanics showcased a comprehensive suite of next-generation semiconductor package substrate technologies targeting the AI and server markets at 'KPCA Show 2026.' The company... -
FCS Group Secures Exclusive Taiwan/Southeast Asia Distribution Rights for CKST Glass Substrate Equipment, Entering AI Advanced Packaging Market
BigGo Finance Taiwan Overview FCS Group, an injection molding machine manufacturer, has secured exclusive distribution rights for CKST (China Korea Smart Technology) glass substrate advanced packaging equipment in Taiwan and Southeast As... -
TRUMPF Resolves Glass Substrate TGV Coating Bottleneck with High-Power HiPIMS, Accelerating Next-Gen AI Chip Packaging Mass Production
Asianews.network Germany Overview Germany's TRUMPF announced a breakthrough in Through Glass Via (TGV) coating for glass substrates, a critical bottleneck, by leveraging its high-power HiPIMS (High Power Impulse Magnetron Sputtering) tec... -
Samsung Electro-Mechanics Unveils Five Next-Gen Semiconductor Package Substrate Products for AI, Automotive, and Mobile Markets at KPCA Show
Global Sources South Korea Overview Samsung Electro-Mechanics showcased next-generation semiconductor package substrate technologies at KPCA Show, targeting high-end chip applications like AI servers, automotive systems, and mobile devic... -
Unimicron Reports 90% Surge in Equipment Demand from AI, Japanese SME Dependence on ABF Substrates Creates Bottleneck
BigGo Finance Taiwan Overview Unimicron Technology Chairman Chien Shan-Chieh stated that escalating AI demand has severely impacted the substrate sector, worsening supply-demand imbalance due to heavy reliance on small and medium-sized J... -
Dell Reports Record Q2 Revenue of $47 Billion with $95 Billion AI Server Backlog; Entire Supply Chain, Including DRAM, HBM, ABF Substrates, at ‘Redline’
KuCoin International Overview Dell reported record Q2 revenue of $47 billion and an impressive $95 billion backlog for AI servers. However, Dell executives stated that the entire supply chain, including DRAM, NAND, specific CPUs, mature ... -
TSMC SVP Reports 90% Surge in Equipment Orders in Six Months Driven by AI Demand: Equivalent to Building 20 Fabs Globally Simultaneously
TechSoda Taiwan Overview TSMC Senior VP Cliff Hou reported an astonishing 90% surge in equipment orders over six months, driven by AI demand far exceeding forecasts, equivalent to constructing nearly 20 fabs worldwide simultaneously. Uni... -
TRUMPF Resolves Glass Substrate TGV Coating Bottleneck with High-Power HiPIMS, Accelerating Next-Gen AI Chip Packaging
TRUMPF Germany Overview TRUMPF has introduced a High-Power Impulse Magnetron Sputtering (HiPIMS) approach to address a key manufacturing challenge in next-generation AI chip packaging: reliably coating millions of minute Through-Glass Vi... -
Glass Substrates Emerge as Key Breakthrough for Next-Gen AI Chip Packaging: Intel, TSMC, Samsung Accelerate Development
Industry Analyst International Overview Glass substrates are increasingly recognized as a critical breakthrough for next-generation AI chip packaging, with industry leaders like Intel, TSMC, and Samsung Electro-Mechanics accelerating the...
