Glass Substrate– tag –
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IEEE ECTC 2026 Highlights Packaging Technologies Redefining AI and HPC Scalability Limits
IEEE Electronic Components and Technology Conference (ECTC) USA Overview The 2026 IEEE Electronic Components and Technology Conference (ECTC) spotlighted packaging technologies redefining AI and HPC scalability limits. Intel Foundry's R&... -
Intel to Build $3.3 Billion Glass Core Substrate Manufacturing Facility in India to Bolster Advanced Packaging Supply
TrendForce USA Overview Intel, in collaboration with 3D Glass Solutions (3DGS), is progressing with plans to invest approximately $3.3 billion in an advanced packaging glass core substrate manufacturing facility in Odisha, India. The pla... -
Rapidus Explores Panel-Level Packaging on Glass Substrates for Next-Gen AI/HPC Processors
Tom's Hardware Japan Overview Japanese semiconductor firm Rapidus is actively exploring the adoption of panel-level packaging (PLP) on large 600mm x 600mm glass panels for manufacturing high-end multi-chiplet processors designed for AI a... -
Glass Substrates Emerge as Next-Generation Solution to AI Chip Packaging Bottleneck
TrendForce Taiwan Overview Glass substrates are gaining significant traction as a next-generation material poised to overcome the limitations of traditional organic substrates and resolve critical bottlenecks in AI chip packaging. Offeri... -
Samsung Electro-Mechanics and Sumitomo Chemical Group Partner to Establish Glass Core Substrate Joint Venture
企業発表 South Korea Overview Samsung Electro-Mechanics and Sumitomo Chemical Group have signed an MOU to establish a joint venture for manufacturing "glass core" substrates, a critical material for next-generation advanced packaging. Ai...
