Glass Substrate– tag –
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TSMC Moves to Large-Format Glass Substrates with CoPoS to Address CoWoS Capacity for AI Chips, Targeting 2028-2029 Mass Production
36Kr, Semiconductor Industry Watch, AI Weekly Taiwan Overview TSMC has launched a pilot line for its CoPoS (Chip-on-Panel-on-Substrate) advanced packaging at Taiwan's VisEra, aiming to alleviate the critical CoWoS capacity bottleneck for... -
Advanced Package Substrate Market Heats Up: Ibiden Leads with $3.2 Billion Investment, Samsung Electro-Mechanics Challenges with Glass Substrates, Technical Hurdles Emerge
MK Japan Overview The package substrate market, crucial for AI semiconductor performance, is intensifying with major investments and technological competition. Japan's Ibiden maintains dominant leadership with ~35% market share, investin... -
South Korea’s JNTC and Japan’s TOPPAN Announce Partnership for AI Chip Glass Substrate Technology, Overcoming Organic Substrate Limits for Next-Gen Packaging
Tai (via Semiconductor News) South Korea Overview South Korea's JNTC and Japan's TOPPAN have forged a strategic partnership for next-generation glass substrate technology aimed at AI chips. As advanced packages integrating AI accelerator... -
Samsung Electro-Mechanics Challenges Ibiden in AI Server Package Substrates with FC-BGA and Glass Substrate Push
MK South Korea Overview Samsung Electro-Mechanics is aggressively challenging Ibiden's dominant market share in AI package substrates by enhancing its Flip-Chip Ball Grid Array (FC-BGA) and next-generation glass substrate technologies fo... -
Taiwan’s TGV Glass Substrate Supply Chain Advances: E&R Engineering Ships Laser Modification Equipment to US Client, Accelerating Mass Production
Taiwan News Taiwan Overview Driven by escalating HPC demand, glass substrates are emerging as a next-generation advanced packaging solution, leading to the formation of a robust Through-Glass Via (TGV) supply chain in Taiwan. E&R Eng... -
TSMC and NVIDIA’s ‘Glass Killer’: How Glass Core Substrates Will Revolutionize AI Chips by 2028
SETN Taiwan Overview Renowned analyst Kuo Ming-Chi reveals TSMC's secretive development of 'glass core substrates' in collaboration with NVIDIA, poised to be a game-changer for next-generation AI chip manufacturing. This innovative techn... -
AI Memory Shortage Sparks Advanced Packaging Crisis: Ultrafast Lasers and Glass Substrates Emerge as New Bottlenecks
Chanelink China Overview A 'capacity crisis' in advanced packaging processes, triggered by the AI memory shortage, is causing ultrafast laser suppliers to become a new bottleneck in the supply chain. AI accelerators demand highly advance... -
BOE Commences Sample Shipments of Glass Substrates for Advanced Chip Packaging to Domestic Customers, Signaling Innovation Boost
36Kr English China Overview Chinese display giant BOE Technology has initiated sample shipments of glass substrates for advanced chip packaging to domestic customers. This move signifies China's technological progress in next-generation ... -
Applied Materials Unveils New Systems for DRAM and Advanced Packaging to Accelerate AI Chip Manufacturing, Featuring Epitaxy, CMP, and E-beam Inspection Technologies
Barchart.com USA Overview Applied Materials has introduced a suite of new chipmaking systems designed to accelerate the construction of advanced 3D chip architectures powering next-generation AI. This includes epitaxy systems optimizing ... -
TSMC Accelerates CoPoS Packaging with Glass Core Substrates: Targets 30% Cost Reduction, >90% Wafer Utilization Post-2028
Wccftech / CHOSUNBIZ / BigGo Finance Taiwan Overview TSMC is accelerating the development of CoPoS packaging, a successor to CoWoS, leveraging glass core substrates co-developed with Ibiden and Innolux. This panel-level packaging approac...
