HBM– tag –
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HBM4 Breaks Bottlenecks: Hybrid Bonding Delivers 20%+ Thermal Reduction, 40% Power Efficiency Boost, 2.0TB/s+ Bandwidth
SemiHub.io International Overview HBM4, the next-generation High Bandwidth Memory, is set to significantly advance AI/HPC performance by doubling its I/O width to 2048 bits, targeting over 2.0 TB/s bandwidth per stack and substantial pow... -
SK Hynix Secures HBM4 Future: 70% Price Surge, 2026 Capacity Sold Out, and $3.87B US Investment for Advanced Packaging Independence
Adalytica and others South Korea Overview SK Hynix has signaled its dominance in the High Bandwidth Memory (HBM) market by reportedly increasing HBM4 prices by 70% for its 2026 supply, which is already entirely presold. Concurrent with t... -
AI Chip Race Shifts to Advanced Packaging as 130M Accelerators Ship; TSMC’s CoWoS Dominates, Intel Pursues Alternatives
The Korea Economic Daily South Korea Overview The competitive landscape in the AI semiconductor market is shifting from process nodes to advanced packaging, with over 130 million AI accelerators projected to ship with advanced-packaged o... -
AI Workloads Fundamentally Reshaping Data Center Power Demand and Infrastructure, IEA Projects Doubled Consumption by 2030
Data Center Dynamics UK Overview AI workloads are profoundly altering data center power demand and infrastructure planning, driven by concentrated compute, heat, and electrical loads per rack. High-power GPUs in AI training clusters nece... -
TSMC Declares AI Advanced Packaging Competition Shifts to System-Level Reliability and Validation, Highlighting 3DIC Importance at OCP APAC 2026
digitimes Taiwan Overview At the OCP APAC 2026 summit, TSMC Vice President of Advanced Packaging Technology & Service, Jun He, announced that the escalating AI computing demand is rapidly increasing chip integration complexity, shift... -
Global Semiconductor Sales Soar 2.2x to Record $134.5 Billion in June 2026; TSMC Achieves Over 99% CoWoS Yield But Flags HBM and ABF Substrate Bottlenecks
Amiko Consulting Japan Overview Global semiconductor sales reached an unprecedented monthly high of $134.5 billion in June 2026, marking a 2.2-fold increase year-over-year, driven by a dramatic surge in AI data center investments across ... -
Global Semiconductor Capital Investment to Surge 30% to $240 Billion in 2026, Driven by AI Inference Demand; Advanced Packaging Fuels Multi-Year Double-Digit Growth
Soka Technology Unknown Overview The global semiconductor industry is projected to enter an unprecedented capital investment supercycle in 2026, driven by a skyrocketing demand for AI inference capabilities. Industry forecasts estimate t... -
Intel Foundry Boosts AI Data Center Compute with Foveros and EMIB Advanced Packaging, EMIB-T Launch Planned for 2026
ET Datacenters India Overview Intel Foundry is actively deploying advanced packaging technologies, including Foveros stacking and Embedded Multi-die Interconnect Bridge (EMIB) interconnects, to meet the escalating demands of AI workloads... -
ASMPT’s Advanced Packaging Business Achieves Record H1 2026 Sales Driven by Surging AI Demand; Panel-Level Packaging Positioned as Key Future Growth Driver
ASMPT Corporate (Press Release) Hong Kong Overview ASMPT reported robust interim results for H1 2026, with its Advanced Packaging (AP) business achieving record sales, primarily fueled by the accelerating demand from the AI sector. The c... -
Samsung Electro-Mechanics Doubles Down on AI: Vietnam Plant to Lead Advanced Packaging Substrate Surge
Vietnam Korea Times Vietnam Overview Samsung Electro-Mechanics (SEMCO) is poised to significantly expand its production of advanced packaging substrates for AI semiconductors, with a reported 2.4-fold capacity increase at its Thai Nguyen...
