HBM– tag –
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Sumitomo Bakelite and Mitsubishi Chemical Raise Packaging Material Prices for CoWoS and HBM Amid Surging Demand
Global Times China Overview Increasing demand for advanced processes and packaging, coupled with rising energy and raw material costs from Middle East conflicts and China's tightened export controls on strategic minerals, is disrupting h... -
TSMC CoWoS and ABF Substrate Supply Bottlenecks Threaten AI Chip Production Amid $265B Market Opportunity
Silicon To Software USA Overview For leading AI accelerators, wafer manufacturing capacity is not the only constraint; CoWoS advanced packaging and ABF (Ajinomoto Build-up Film) substrate qualification cycles are also limiting production... -
SK Hynix Breaks Ground on $3.87 Billion Advanced Packaging Plant in Indiana for HBM Production
The Korea Herald South Korea Overview SK Hynix is set to hold a groundbreaking ceremony this month for a $3.87 billion advanced chip packaging plant in Indiana, intensifying its U.S. presence in AI chip production. The facility, near Pur... -
Applied Materials Raises Advanced Packaging Revenue Forecast to Over 70% Growth on AI Demand, Unveils New HBM Systems
TrendForce USA Overview Applied Materials has significantly revised its advanced packaging revenue forecast for 2026 to over 70% year-over-year growth, a 20-percentage-point increase in just three months, driven by soaring AI semiconduct... -
JCET Achieves 79.4% YoY Net Profit Growth in H1 2026, Accelerates Advanced Packaging to Meet AI Demand
PR Newswire China Overview JCET Group, a leading global outsourced semiconductor assembly and test (OSAT) provider, reported impressive financial results for the first half of 2026, with net profit attributable to shareholders surging by... -
Amkor Technology Expands U.S. Advanced Packaging Footprint by 67 Acres in Arizona, Bolstering Domestic Manufacturing
Amkor Technology, Inc. USA Overview Amkor Technology has secured an additional 67 acres (approximately 270,000 square meters) adjacent to its existing advanced packaging and test campus in Arizona, significantly expanding its U.S. back-e... -
Hanmi Semiconductor Invests $92 Million in Largest-Ever 8th Plant for AI/HBM Demand, Enters U.S. Market
Pulse 2.0 South Korea Overview South Korean Hanmi Semiconductor is investing approximately 130 billion won (about $92 million) to construct its largest-ever 8th production facility, a direct response to the explosive demand for AI and Hi... -
China Invests 40 Billion Yuan ($5.5 Billion) in New Advanced Packaging Projects for AI/HPC to Prepare for Next Chip Shortage
All-About-Industries China Overview China's advanced packaging industry is embarking on a new wave of capacity expansion to meet the escalating demand for AI and High-Performance Computing (HPC) chips. Between May and July 2026, approxim... -
Hanmi Semiconductor Leads HBM4 TC Bonder Market, Diversifies Client Base with Micron Deals to Reduce SK Hynix Dependency
digitimes Taiwan Overview Hanmi Semiconductor has gained a significant lead over competitor Hanwha Semitech in the crucial thermal compression (TC) bonder market for High Bandwidth Memory (HBM) manufacturing. This market advantage is dri... -
SK Hynix Pioneers Optical Interconnects Beyond HBM, Outlines Roadmap for AI Bandwidth Challenges
Adalytica South Korea Overview SK Hynix is charting a course for optical chip connections that extend beyond High Bandwidth Memory (HBM) to address critical bandwidth limitations in large-scale AI systems. A recent Nature Electronics rev...
