HBM– tag –
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Applied Materials Unveils New Hybrid Bonding Platform for High-Volume 3D Stacked Chip Manufacturing, Enabling Ultra-Fine Pitch Integration
Business Wire USA Overview Applied Materials has launched a new hybrid bonding platform designed for high-volume manufacturing of next-generation 3D stacked chips. This innovative system achieves high-precision alignment and high through... -
Ajinomoto Fine-Techno to Expand ABF Film Production Capacity, Anticipates Easing AI Chip Supply Shortages by Early 2027
The Wall Street Journal Japan Overview Ajinomoto Fine-Techno disclosed plans to significantly boost its production capacity for Ajinomoto Build-up Film (ABF) film across multiple manufacturing sites, driven by exploding demand for AI chi... -
Resonac Develops Innovative Thermal Management Materials Achieving 30% Thermal Conductivity Improvement for AI/HPC Semiconductor Packages
Chemical Daily Japan Overview Resonac has announced the development of groundbreaking thermal interface materials (TIMs) and encapsulants that boast a 30% improvement in thermal conductivity over conventional products. This innovation di... -
Ibiden Announces Significant Yield Improvement in AI Chip ABF Substrates with New Process Technology, Stabilizing Supply
Nikkei Asia Japan Overview Ibiden has reported a substantial improvement in manufacturing yield for Ajinomoto Build-up Film (ABF) substrates used in AI processors, driven by the introduction of a new process technology. This advancement ... -
Samsung Electro-Mechanics Boosts FC-BGA Substrate Capacity by 20% for AI/HPC, Enhances Competitiveness with Fine-Pitch Wiring
The Korea Economic Daily South Korea Overview Samsung Electro-Mechanics (SEMCO) announced a 20% expansion of its high-end FC-BGA substrate production capacity in South Korea, driven by surging demand from AI/HPC applications. This strate... -
Unimicron Initiates Mass Production at New Thai ABF Substrate Plant to Meet Surging AI Server Demand, Diversifying Geopolitical Risk
DigiTimes Japan Taiwan Overview Unimicron has commenced mass production at its new facility in Thailand, addressing the escalating demand for Ajinomoto Build-up Film (ABF) substrates, especially for AI servers. This strategic expansion a... -
ASMPT to Showcase Advanced Thermocompression and Hybrid Bonding Innovations for HPC and AI at SEMICON Taiwan 2026
ASMPT SEMI Solutions Taiwan Overview Global technology leader ASMPT announced it will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, supporting HPC, AI accelerators, silicon photonics, and Co-Packaged Optics (CPO) appl... -
Google’s Next-Gen TPUs Adopt Intel EMIB Packaging, Achieve Yield Targets in First Mass Production
digitimes Taiwan Overview Google has successfully implemented Intel's Embedded Multi-die Interconnect Bridge (EMIB) packaging technology for mass production of its next-generation TPUs, already achieving yield targets. This strategic mov... -
Namics Introduces Ultra-Fine-Pitch Underfill to Bolster HBM Reliability for AI and HPC
Namics News & Events Japan Overview Namics has launched a novel capillary underfill material engineered for the extreme fine-pitch flip-chip interconnections vital to High Bandwidth Memory (HBM) stacks. This innovation addresses critical... -
HANMI Semiconductor Invests $91.4 Million in Largest-Ever 8th Production Facility in Incheon to Meet Soaring AI Chip Demand
Business Wire South Korea Overview HANMI Semiconductor is investing $91.4 million (approximately 130 billion KRW) to establish its largest-ever 8th production facility in Incheon, by acquiring Mercury Co., Ltd.'s factory, to proactively ...
